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TLC5924RHBTG4

Texas Instruments

TLC5924RHBTG4 by Texas Instruments

TLC5924RHBTG4 by Texas Instruments is a graphics display driver with 32 terminals, operating voltage range of 3-5.5V, and constant-current output. It is ideal for LED display applications due to its serial data input mode, industrial temperature grade, and compact square package design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,517 parts In-Stock

1+ parts

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6,517

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Digiode

USA . 4,033 parts In-Stock

1+ parts

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4,033

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,606 parts In-Stock

1+ parts

$10.371

100+ parts

-

1k+ parts

$10.887

10k+ parts

-

1,606

$10.371

-

$10.887

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DigiPath Technology Company

USA . 1,526 parts In-Stock

1+ parts

$11.420

100+ parts

$10.506

1k+ parts

-

10k+ parts

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1,526

$11.420

$10.506

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IDEA Electronic Components Group

UK . 813 parts In-Stock

1+ parts

$11.653

100+ parts

$11.070

1k+ parts

$10.488

10k+ parts

-

813

$11.653

$11.070

$10.488

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ChromeModa Solutions

Germany . 381 parts In-Stock

1+ parts

$11.653

100+ parts

$9.555

1k+ parts

-

10k+ parts

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381

$11.653

$9.555

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AZTECH Wire

Italy . 810 parts In-Stock

1+ parts

$19.341

100+ parts

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810

$19.341

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One Stop Electronics

USA . 578 parts In-Stock

1+ parts

$27.500

100+ parts

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578

$27.500

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Corphita

USA . 2,777 parts In-Stock

1+ parts

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2,777

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Microchip USA

USA . 1,269 parts In-Stock

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1,269

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Overview

Elevate your graphics displays with the TLC5924RHBTG4 from Texas Instruments, a leading manufacturer known for quality and reliability. This graphics display driver offers seamless data input via serial mode, making it versatile for various applications. With a wide supply voltage range, compact package style, and constant-current output characteristics, this product delivers exceptional value and performance. Enhance your visual displays with the TLC5924RHBTG4 and experience superior quality like never before.

Feature Benefit Bullets

Data Input Mode: SERIAL

Allows for easy communication with other devices and ensures fast data transfer.

Surface Mount: YES

Enables easy integration onto circuit boards, saving space and making installation more convenient.

Maximum Supply Voltage: 5.5 V

Provides a high voltage tolerance for reliable performance and flexibility in power supply options.

Package Shape: SQUARE

A compact and symmetrical shape that facilitates placement on the board and ensures efficient use of space.

Power Supplies (V): 3/5

Supports multiple power supply options, offering flexibility in design and compatibility with different systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, ensuring stable operation even under challenging conditions.

Technical Specifications

Graphics Display Drivers TLC5924RHBTG4 attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

SERIAL

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

16

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

CONSTANT-CURRENT

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Display Drivers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

15 V

Minimum Supply Voltage-1:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

30 MHz

Trade Compliance

TLC5924RHBTG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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