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TLC59212IN

Texas Instruments

TLC59212IN by Texas Instruments

TLC59212IN by Texas Instruments is an 8-bit line driver with a supply voltage range of 4.5V to 5.5V, suitable for industrial applications. It features BICMOS technology, operates b/w -40°C to 85°C, and has a max receive delay of 0ns. The package style is in-line with 20 terminals and nickel palladium gold terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,041 parts In-Stock

1+ parts

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5,041

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Digiode

USA . 1,219 parts In-Stock

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1,219

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Prism Electronics

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,361 parts In-Stock

1+ parts

$11.129

100+ parts

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$11.582

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1,361

$11.129

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$11.582

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IDEA Electronic Components Group

UK . 2,210 parts In-Stock

1+ parts

$12.505

100+ parts

$11.880

1k+ parts

$11.254

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-

2,210

$12.505

$11.880

$11.254

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ChromeModa Solutions

Germany . 142 parts In-Stock

1+ parts

$12.505

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$10.254

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142

$12.505

$10.254

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AZTECH Wire

Italy . 277 parts In-Stock

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$18.018

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277

$18.018

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One Stop Electronics

USA . 955 parts In-Stock

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$18.500

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955

$18.500

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Microchip USA

USA . 2,609 parts In-Stock

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2,609

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Perfect Parts

USA . 1,415 parts In-Stock

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1,415

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DigiPath Technology Company

USA . 657 parts In-Stock

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$11.275

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$11.275

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Corphita

USA . 424 parts In-Stock

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Overview

Elevate your electronics projects with the TLC59212IN by Texas Instruments, a top-of-the-line line driver & receiver that delivers unmatched quality and reliability. Manufactured by industry leader Texas Instruments, this versatile component offers 8 functions in a compact rectangular package, providing seamless integration and enhanced performance. Ideal for a wide range of applications, this innovative product boasts a robust design and industrial-grade temperature tolerance, making it a must-have for any electronic enthusiast. Upgrade your projects today with the TLC59212IN and experience the value and benefits it brings to your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and protection for the internal components of the line driver & receiver.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage allows for flexibility in power input options and can support a wider range of applications.

No. of Functions: 8

Having 8 functions in one device can streamline your circuit design and reduce the need for multiple components, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular shape is commonly used and easy to incorporate into various circuit layouts and designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this line driver & receiver can withstand harsh industrial environments without compromising performance.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Technical Specifications

Line Drivers & Receivers TLC59212IN attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

8

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

No. of Functions:

8

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TLC59212IN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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