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TLC5540EVM

Texas Instruments

TLC5540EVM by Texas Instruments

TLC5540EVM by Texas Instruments is an 8-bit ADC Evaluation Board with a 40MSPS sampling rate and 0-5V input range. It utilizes TLC5540 IC, consumes 85mW @ 5V power, and features a parallel data interface. Ideal for developing ADC applications in bulk packaging.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,292 parts In-Stock

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Digiode

USA . 4,938 parts In-Stock

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AZTECH Wire

Italy . 699 parts In-Stock

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$5.240

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699

$5.240

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Component Stockers USA

USA . 501 parts In-Stock

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$99.990

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501

$99.990

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Semicontronic

India . 892 parts In-Stock

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$126.100

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$122.948

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$122.317

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892

$126.100

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Ampacity Inc.

Singapore . 1,289 parts In-Stock

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$159.100

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One Stop Electronics

USA . 466 parts In-Stock

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$188.100

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466

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ChromeModa Solutions

Germany . 5,701 parts In-Stock

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Parana Technologies

USA . 2,370 parts In-Stock

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$1.291

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IDEA Electronic Components Group

UK . 1,885 parts In-Stock

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DigiPath Technology Company

USA . 1,485 parts In-Stock

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Corphita

USA . 1,466 parts In-Stock

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Corohmni

South Africa . 352 parts In-Stock

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Overview

Experience the exceptional quality and precision of Texas Instruments with the TLC5540EVM. This development board offers unparalleled performance in analog to digital conversion applications, making it a valuable asset for engineers and hobbyists alike. With a sampling rate of 40M samples per second and a power consumption of only 85mW at 5V, this board provides high-speed data acquisition while being energy efficient. The versatility of the TLC5540EVM makes it ideal for a wide range of projects, from sensor interfacing to audio signal processing. Trust Texas Instruments to deliver top-of-the-line solutions for your electronic needs.

Feature Benefit Bullets

Other Names: 296-10337

Easy to identify and order by using known product names.

Category: Development Boards, Kits, Programmers / Evaluation Boards / Analog to Digital Converters (ADCs) Evaluation Boards

Specifically designed for evaluating and testing analog to digital converters, making it a reliable choice for developing and testing ADC applications.

Package: Bulk

Bulk packaging is cost-effective for purchasing multiple units at once.

Number of Bits: 8

Provides sufficient resolution for accurate analog to digital conversion.

Sampling Rate (Per Second): 40M

High sampling rate allows for capturing fast-changing input signals accurately.

Data Interface: Parallel

Parallel data interface enables high-speed data transfer between the ADC and other components in the system.

Input Range: 0 ~ 5V

Wide input range accommodates a variety of input signal levels.

Power (Typ) @ Conditions: 85mW @ 5V

Low power consumption ensures efficient operation.

Utilized IC / Part: TLC5540

Utilizes a reliable and well-known ADC component for accurate conversion.

Supplied Contents: Board(s)

Comes with necessary boards for immediate testing and evaluation of the ADC.

Base Product Number: TLC554

Based on a well-established product line known for quality and performance.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Can be stored and handled in various environments without the risk of moisture damage.

Technical Specifications

Additional Parts TLC5540EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

-296-10337
296-10337-NDR
-TLC5540EVM-NDR
-296-10337-ND
296-10337

Category:

Development Boards, Kits, Programmers
Evaluation Boards Analog to Digital Converters (ADCs) Evaluation Boards

Number of A/D Converters:

1

Data Interface:

Parallel

Standard Package:

1

Supplied Contents:

Board(s)

Input Range:

0 ~ 5V

Number of Bits:

8

Utilized IC / Part:

TLC5540

Package:

Bulk

Sampling Rate (Per Second):

40M

Power (Typ) @ Conditions:

85mW @ 5V

Base Product Number:

TLC554

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TLC5540EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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