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TLC5510EVM

Texas Instruments

TLC5510EVM by Texas Instruments

TLC5510EVM by Texas Instruments is an 8-bit ADC Evaluation Board with a sampling rate of 20MSPS. It features a ±2V input range and operates at 130mW power consumption. The board is designed for evaluating the performance of TLC5510 IC in applications requiring high-speed analog to digital conversion.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 5,908 parts In-Stock

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Digiode

USA . 2,061 parts In-Stock

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AZTECH Wire

Italy . 580 parts In-Stock

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$19.270

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One Stop Electronics

USA . 899 parts In-Stock

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$167.100

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Ampacity Inc.

Singapore . 539 parts In-Stock

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$216.100

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Semicontronic

India . 678 parts In-Stock

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$231.100

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$225.322

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$224.167

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ChromeModa Solutions

Germany . 2,876 parts In-Stock

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DigiPath Technology Company

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IDEA Electronic Components Group

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Parana Technologies

USA . 832 parts In-Stock

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Corohmni

South Africa . 337 parts In-Stock

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Corphita

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Assy Fe

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Overview

Discover the innovative TLC5510EVM by Texas Instruments, a top-quality development board that offers unmatched performance and reliability. With its cutting-edge Analog to Digital Converters (ADCs) Evaluation Boards, this product is perfect for a wide range of applications. From precision measurements to industrial automation, the TLC5510EVM delivers exceptional value to customers with its high sampling rate, versatile data interface, and low power consumption. Trust Texas Instruments for superior quality and experience the benefits of the TLC5510EVM for your next project.

Feature Benefit Bullets

Other Names: 296-10332, TLC5510EVM-NDR, 296-10332-ND, 296-10332-NDR

Having multiple names helps in easy identification and searching of the product.

Category: Development Boards, Kits, Programmers, Evaluation Boards, Analog to Digital Converters (ADCs) Evaluation Boards

This product falls under multiple categories, making it versatile and suitable for various applications.

Package: Bulk

Bulk packaging is beneficial for manufacturers or those who require multiple units of the product.

Number of Bits: 8

8 bits provide sufficient resolution for many applications while keeping the design simple and cost-effective.

Sampling Rate (Per Second): 20M

The high sampling rate of 20M per second allows for precise and quick data acquisition, suitable for high-speed applications.

Data Interface: Parallel

Parallel data interface enables faster data transfer compared to serial interfaces, beneficial for applications requiring high data throughput.

Input Range: ±2V

Wide input range of ±2V allows for flexibility in accepting various input signals without the need for additional signal conditioning.

Power (Typ) @ Conditions: 130mW @ 20MSPS

Low power consumption of 130mW at 20MSPS makes it energy-efficient, suitable for portable or low-power devices.

Utilized IC / Part: TLC5510

The TLC5510 integrated circuit is known for its performance and reliability, ensuring high-quality data conversion.

Supplied Contents: Board(s)

The inclusion of the necessary board(s) in the package simplifies setup and usage for the customers.

Base Product Number: TLC551

Being part of the TLC551 product line ensures compatibility and integration with other products from the same family.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Having MSL level 1 means the product can be stored and handled without strict humidity control, simplifying logistics and storage.

Technical Specifications

Additional Parts TLC5510EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-10332
-TLC5510EVM-NDR
-296-10332
-296-10332-ND
296-10332-NDR

Category:

Development Boards, Kits, Programmers
Evaluation Boards Analog to Digital Converters (ADCs) Evaluation Boards

Number of A/D Converters:

1

Data Interface:

Parallel

Standard Package:

1

Supplied Contents:

Board(s)

Input Range:

±2V

Number of Bits:

8

Utilized IC / Part:

TLC5510

Package:

Bulk

Sampling Rate (Per Second):

20M

Power (Typ) @ Conditions:

130mW @ 20MSPS

Base Product Number:

TLC551

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TLC5510EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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