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TLC27L2IDG4

Texas Instruments

TLC27L2IDG4 by Texas Instruments

TLC27L2IDG4 by Texas Instruments is a dual operational amplifier with low bias current (0.002 uA) and micropower feature. Ideal for industrial applications, it offers high common mode rejection ratio (94 dB) and operates at wide temperature range (-40 to 85 °C). Its compact design (3.9mm x 4.9mm) makes it suitable for surface mount applications.

Median Price

$1.590

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 654 parts In-Stock

1+ parts

$1.590

100+ parts

$1.100

1k+ parts

$0.934

10k+ parts

$0.736

654

$1.590

$1.100

$0.934

$0.736

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,157 parts In-Stock

1+ parts

$1.510

100+ parts

-

1k+ parts

-

10k+ parts

-

3,157

$1.510

-

-

-

Vyrian

USA . 7,133 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,133

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,482 parts In-Stock

1+ parts

$1.431

100+ parts

-

1k+ parts

-

10k+ parts

-

4,482

$1.431

-

-

-

Parana Technologies

USA . 1,766 parts In-Stock

1+ parts

$3.841

100+ parts

-

1k+ parts

$4.326

10k+ parts

-

1,766

$3.841

-

$4.326

-

DigiPath Technology Company

USA . 140 parts In-Stock

1+ parts

$4.230

100+ parts

$3.891

1k+ parts

-

10k+ parts

-

140

$4.230

$3.891

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-

ChromeModa Solutions

Germany . 4,821 parts In-Stock

1+ parts

$4.316

100+ parts

$3.539

1k+ parts

-

10k+ parts

-

4,821

$4.316

$3.539

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IDEA Electronic Components Group

UK . 1,911 parts In-Stock

1+ parts

$4.316

100+ parts

-

1k+ parts

$3.884

10k+ parts

-

1,911

$4.316

-

$3.884

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Overview

Unlock the power of precision with the TLC27L2IDG4 from Texas Instruments. This operational amplifier (Op Amp) offers unmatched quality and reliability for a wide range of applications. With low bias current and micropower technology, this device delivers exceptional performance in industrial settings. The compact design and surface-mount capability make it perfect for space-constrained projects. Trust Texas Instruments to provide you with cutting-edge solutions that exceed your expectations. Elevate your designs with the TLC27L2IDG4 and experience unparalleled value like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications.

Maximum Input Offset Voltage: 10000 uV

Low input offset voltage ensures accurate signal processing in the operational amplifier.

Maximum Average Bias Current (IIB): 0.002 uA

Low bias current ensures minimal power consumption and accurate operation of the amplifier.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Nominal Common Mode Reject Ratio: 94 dB

High Common Mode Reject Ratio (CMRR) ensures that the amplifier can effectively reject common-mode signals, resulting in accurate output.

Power Supplies (V): 4/16

Support for multiple power supply voltages provides flexibility in different operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, making the amplifier suitable for battery-powered applications.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture ensures stable operation and precise control of gain in the operational amplifier.

Nominal Unity Gain Bandwidth: 85 kHz

High unity gain bandwidth allows for accurate signal amplification across a wide frequency range.

Technical Specifications

Operational Amplifiers (Op Amps) TLC27L2IDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

4/16 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

85 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

94 dB

Minimum Common Mode Rejection Ratio (CMRR ):

65 dB

Input Offset Voltage Limit:

10000 uV

Minimum Voltage Gain:

50000

Minimum Slew Rate:

0.02 V/us

Nominal Slew Rate:

0.03 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

2 nA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

34 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLC27L2IDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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