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TLC27L2BIDRG4

Texas Instruments

TLC27L2BIDRG4 by Texas Instruments

TLC27L2BIDRG4 by Texas Instruments is a dual operational amplifier with low bias current (0.00006 uA) and micropower feature. It operates at industrial temperature range (-40 to 85 °C) and has a unity gain bandwidth of 130 kHz. Ideal for applications requiring precise signal amplification in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,314 parts In-Stock

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Digiode

USA . 1,071 parts In-Stock

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1,071

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Nova Conductors

Japan . 42 parts In-Stock

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42

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Distributors (Availability)

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One Stop Electronics

USA . 633 parts In-Stock

1+ parts

$0.410

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633

$0.410

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Parana Technologies

USA . 696 parts In-Stock

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$3.827

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$4.314

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696

$3.827

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$4.314

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DigiPath Technology Company

USA . 1,144 parts In-Stock

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$4.214

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$3.877

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$4.214

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ChromeModa Solutions

Germany . 3,063 parts In-Stock

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$4.300

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$3.526

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3,063

$4.300

$3.526

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IDEA Electronic Components Group

UK . 429 parts In-Stock

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$4.300

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$3.870

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429

$4.300

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$3.870

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Ampacity Inc.

Singapore . 1,504 parts In-Stock

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$4.410

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$4.410

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AZTECH Wire

Italy . 549 parts In-Stock

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$19.728

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549

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A-Z Elektronik GmbH

Germany . 5,937 parts In-Stock

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Corphita

USA . 3,709 parts In-Stock

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Microchip USA

USA . 2,530 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Overview

Discover the perfect balance of performance and reliability with the TLC27L2BIDRG4 Operational Amplifier by Texas Instruments. This cutting-edge device offers unparalleled quality and precision, making it the ideal choice for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this op amp delivers superior results every time. Experience the value and benefits of seamless operation, high efficiency, and exceptional output with the TLC27L2BIDRG4. Elevate your projects to new heights with this innovative solution that sets the standard for excellence in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for its durability and reliability, making the product suitable for various industrial applications.

Maximum Input Offset Voltage: 3500 uV

A low input offset voltage ensures accurate and precise operation of the amplifier, which is essential for high-performance applications.

Surface Mount: YES

Surface mount packaging allows for easy and efficient installation on circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 5

Operating at a lower supply voltage can result in reduced power consumption and improved efficiency, which is beneficial for portable or battery-powered devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-powered or noise-sensitive applications.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier allows for versatile signal processing capabilities, making it suitable for a wide range of applications in electronics and communications.

Technical Specifications

Operational Amplifiers (Op Amps) TLC27L2BIDRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

4/16 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

130 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

95 dB

Minimum Common Mode Rejection Ratio (CMRR ):

65 dB

Input Offset Voltage Limit:

3500 uV

Minimum Voltage Gain:

50000

Minimum Slew Rate:

0.02 V/us

Nominal Slew Rate:

0.04 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

2 nA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

34 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLC27L2BIDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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