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TLC274BIDRG4

Texas Instruments

TLC274BIDRG4 by Texas Instruments

TLC274BIDRG4 by Texas Instruments is an Operational Amplifier with 4 functions, offering a Max Input Offset Voltage of 3500uV and Nominal Voltage of 5V. Ideal for industrial applications, it features low-bias technology, a Unity Gain Bandwidth of 1700kHz, and operates in temperatures ranging from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,241 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Digiode

USA . 215 parts In-Stock

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215

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One Stop Electronics

USA . 1,142 parts In-Stock

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$0.410

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$0.410

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Semicontronic

India . 1,455 parts In-Stock

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$4.410

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$4.300

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$4.278

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$4.410

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Corohmni

South Africa . 93 parts In-Stock

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$4.718

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Parana Technologies

USA . 1,959 parts In-Stock

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$6.042

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$6.821

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DigiPath Technology Company

USA . 1,937 parts In-Stock

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$6.653

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$6.121

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ChromeModa Solutions

Germany . 6,068 parts In-Stock

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$6.789

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$5.567

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IDEA Electronic Components Group

UK . 126 parts In-Stock

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$6.789

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$6.110

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$7.093

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Ampacity Inc.

Singapore . 842 parts In-Stock

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AZTECH Wire

Italy . 454 parts In-Stock

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$15.588

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Continental Prestige Electronics

USA . 6,738 parts In-Stock

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Argo Parts USA

USA . 4,137 parts In-Stock

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Microchip USA

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Corphita

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iodParts Technologies Inc.

India . 900 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Unlock the power of precision with the TLC274BIDRG4 by Texas Instruments. Crafted by a trusted manufacturer, this operational amplifier offers unparalleled quality and reliability. Ideal for a wide range of applications, this product boasts low-bias, low-input offset voltage, and high common mode rejection ratio. Experience seamless performance with a nominal unity gain bandwidth of 1700 kHz and a minimum voltage gain of 10000. Trust in Texas Instruments to deliver exceptional value and benefits, making the TLC274BIDRG4 the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the operational amplifier.

Maximum Input Offset Voltage: 3500 uV

Low input offset voltage ensures accurate signal processing and minimal error in output.

Surface Mount: YES

Easily mountable on circuit boards, making it suitable for compact electronic devices.

Nominal Common Mode Reject Ratio: 80 dB

High common mode rejection ratio helps in reducing noise and interference in the input signals.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard supply voltage of 5V, making it compatible with many electronic systems.

Technology: CMOS

Uses CMOS technology for low power consumption and high integration, making it ideal for portable or battery-operated devices.

Architechture: VOLTAGE-FEEDBACK

Utilizes voltage-feedback architecture for stable and precise amplification of input signals.

Technical Specifications

Operational Amplifiers (Op Amps) TLC274BIDRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

4/16 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.7 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Minimum Common Mode Rejection Ratio (CMRR ):

65 dB

Input Offset Voltage Limit:

3500 uV

Minimum Voltage Gain:

10000

Nominal Slew Rate:

3.6 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

60 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

6.4 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLC274BIDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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