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TLC274BIDG4

Texas Instruments

TLC274BIDG4 by Texas Instruments

TLC274BIDG4 by Texas Instruments is a CMOS operational amplifier with 4 functions, offering low bias current of 0.00006 uA. With a unity gain bandwidth of 1700 kHz and common mode reject ratio of 80 dB, it's ideal for industrial applications requiring precise voltage feedback amplification in compact designs. The package is small outline, surface mountable, and operates within -40 to 85 °C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,673 parts In-Stock

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3,673

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Vyrian

USA . 2,586 parts In-Stock

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2,586

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Parana Technologies

USA . 2,005 parts In-Stock

1+ parts

$2.323

100+ parts

$215.716

1k+ parts

$2.091

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2,005

$2.323

$215.716

$2.091

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Ampacity Inc.

Singapore . 999 parts In-Stock

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$2.410

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$2.410

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DigiPath Technology Company

USA . 370 parts In-Stock

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$2.558

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370

$2.558

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ChromeModa Solutions

Germany . 614 parts In-Stock

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$2.610

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$2.140

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614

$2.610

$2.140

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IDEA Electronic Components Group

UK . 119 parts In-Stock

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$2.610

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$2.349

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119

$2.610

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$2.349

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One Stop Electronics

USA . 1,128 parts In-Stock

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$3.410

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$3.410

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Corohmni

South Africa . 786 parts In-Stock

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$4.042

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786

$4.042

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AZTECH Wire

Italy . 449 parts In-Stock

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$16.453

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Continental Prestige Electronics

USA . 4,197 parts In-Stock

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Argo Parts USA

USA . 2,206 parts In-Stock

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Microchip USA

USA . 1,819 parts In-Stock

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Corphita

USA . 590 parts In-Stock

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iodParts Technologies Inc.

India . 350 parts In-Stock

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Bastille Electronics

Australia . 36 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the TLC274BIDG4 operational amplifier by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and cutting-edge technology in all their products. Ideal for a wide range of applications, this Op Amp offers superior functionality and precision, making it a valuable asset for engineers and hobbyists alike. Trust Texas Instruments to provide the innovation and efficiency you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Maximum Input Offset Voltage: 3500 uV

The low maximum input offset voltage ensures minimal error in the output signal, making the product accurate and reliable.

Surface Mount: YES

The surface mount capability makes installation easier and allows for efficient use of PCB space.

Nominal Common Mode Reject Ratio: 80 dB

With a high common mode reject ratio, the product can effectively reject common-mode noise, leading to a clean output signal.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes the product compatible with a wide range of systems and power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can function reliably in various environmental conditions.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, enhancing the overall performance.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, the product is designed for high gain and accuracy in amplifying signals, making it suitable for precision applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLC274BIDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

4/16 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.7 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Minimum Common Mode Rejection Ratio (CMRR ):

65 dB

Input Offset Voltage Limit:

3500 uV

Minimum Voltage Gain:

5000

Nominal Slew Rate:

3.6 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

60 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

6.4 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLC274BIDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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