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TLC271BIDG4

Texas Instruments

TLC271BIDG4 by Texas Instruments

TLC271BIDG4 by Texas Instruments is an Operational Amplifier with 3500uV Max Input Offset Voltage, 80dB Nominal CMRR, and 1700kHz Unity Gain Bandwidth. Ideal for industrial applications requiring low-bias amplification in a compact package. Features include low bias current, high common mode rejection ratio, and voltage-feedback architecture.

Median Price

$2.180

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 747 parts In-Stock

1+ parts

$2.180

100+ parts

$1.300

1k+ parts

$1.180

10k+ parts

$1.070

747

$2.180

$1.300

$1.180

$1.070

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,234 parts In-Stock

1+ parts

$1.539

100+ parts

-

1k+ parts

-

10k+ parts

-

2,234

$1.539

-

-

-

Vyrian

USA . 3,954 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,954

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,116 parts In-Stock

1+ parts

$1.458

100+ parts

-

1k+ parts

-

10k+ parts

-

3,116

$1.458

-

-

-

Parana Technologies

USA . 1,496 parts In-Stock

1+ parts

$4.637

100+ parts

-

1k+ parts

$5.112

10k+ parts

-

1,496

$4.637

-

$5.112

-

IDEA Electronic Components Group

UK . 501 parts In-Stock

1+ parts

$5.210

100+ parts

-

1k+ parts

$4.689

10k+ parts

-

501

$5.210

-

$4.689

-

ChromeModa Solutions

Germany . 345 parts In-Stock

1+ parts

$5.210

100+ parts

$4.272

1k+ parts

-

10k+ parts

-

345

$5.210

$4.272

-

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DigiPath Technology Company

USA . 928 parts In-Stock

1+ parts

-

100+ parts

$4.697

1k+ parts

-

10k+ parts

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928

-

$4.697

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Microchip USA

USA . 498 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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498

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Overview

Unlock the potential of your electronic projects with the TLC271BIDG4 operational amplifier by Texas Instruments. Renowned for its quality and reliability, Texas Instruments delivers cutting-edge technology in a compact rectangular package. Ideal for a wide range of applications, this op amp offers high performance with minimal power consumption. Experience superior signal processing, precise voltage amplification, and seamless integration with ease. Elevate your designs with the TLC271BIDG4 and let innovation flourish.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for a variety of applications.

Maximum Input Offset Voltage: 3500 uV

The low maximum input offset voltage ensures accurate signal processing and minimizes errors in the output.

Maximum Average Bias Current (IIB): 0.00006 uA

The extremely low bias current helps in maintaining the accuracy of the amplifier while consuming minimal power.

Surface Mount: YES

The surface mount feature allows for easy and efficient integration of the amplifier onto a circuit board, saving space and simplifying assembly.

Nominal Common Mode Reject Ratio: 80 dB

A high common mode reject ratio ensures effective rejection of noise and interference, resulting in a clean and precise output signal.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V makes this amplifier suitable for various low power applications while providing sufficient power for operation.

Power Supplies (V): 4/16

With dual power supply options of 4V and 16V, this amplifier offers flexibility in designing circuits with different supply voltage requirements.

No. of Terminals: 8

The 8 terminals provide ample connectivity options for input, output, power supply, and other connections, enabling versatile circuit configurations.

Maximum Input Offset Current (IIO): 0.00006 uA

The minimal input offset current ensures low input bias and contributes to the accuracy and stability of the amplifier's performance.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for compact and space-saving PCB designs, ideal for applications where size constraints are critical.

Maximum Supply Voltage Limit: 18 V

The high supply voltage limit of 18V provides a wide operating range, making this amplifier suitable for various industrial and automotive applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in harsh environments with elevated temperatures, increasing the amplifier's durability.

Frequency Compensation: YES

Frequency compensation helps in stabilizing the amplifier's response at different frequencies, ensuring consistent performance across a wide range of signal frequencies.

Minimum Voltage Gain: 10000

The high minimum voltage gain of 10000 indicates the amplifier's ability to amplify input signals efficiently, making it suitable for applications requiring high gain.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the amplifier to function reliably in cold environments, providing versatility in application scenarios with varying temperature conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold finish on terminals provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Terminal Position: DUAL

Dual terminal positions offer flexibility in mounting and connecting the amplifier, accommodating different PCB layouts and design requirements.

Maximum Seated Height: 1.75 mm

The low maximum seated height minimizes the overall profile of the amplifier, making it suitable for compact device designs and applications with space constraints.

Width: 3.9 mm

The narrow width of 3.9mm allows for efficient space utilization on the PCB, enabling compact circuit layouts and streamlined designs.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the amplifier can withstand high-temperature soldering processes, ensuring reliable solder joints during assembly.

Length: 4.9 mm

The compact length of 4.9mm further contributes to the amplifier's space-saving design, making it suitable for miniaturized electronic devices and applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies the amplifier's robustness and reliability in industrial environments, meeting stringent temperature and performance requirements.

Low-Bias: YES

The low-bias feature ensures minimal bias current, reducing power consumption and improving accuracy in signal processing applications.

Nominal Unity Gain Bandwidth: 1700 kHz

The high nominal unity gain bandwidth of 1700 kHz indicates the amplifier's capability to operate effectively at high frequencies, making it suitable for wideband applications.

Minimum Common Mode Reject Ratio: 65 dB

Although on the lower side, the minimum common mode reject ratio of 65 dB still provides effective rejection of common-mode noise, ensuring clean output signals in most applications.

Technology: CMOS

The CMOS technology offers low power consumption and high input impedance, making the amplifier suitable for battery-powered devices and high-impedance input applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections during soldering, ensuring a stable electrical interface and ease of assembly.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this product offers high gain, high input impedance, and versatile signal processing capabilities, making it a fundamental component in many electronic circuits.

Maximum Supply Current: 1.6 mA

The low maximum supply current of 1.6 mA indicates the amplifier's efficiency in power consumption, making it suitable for battery-operated devices and energy-efficient applications.

Architecture: VOLTAGE-FEEDBACK

The voltage-feedback architecture provides stable and predictable amplifier performance, ensuring accurate signal processing and maintaining overall circuit stability.

Packing Method: TUBE

The tube packing method offers protection and easy handling during transportation and storage, ensuring the amplifier's integrity and reliability until it reaches the end user.

Programmable Power: YES

The programmable power feature allows for efficient power management and customization of operating parameters, offering flexibility in adapting the amplifier to different system requirements.

Nominal Slow Rate: 3.6 V/us

The nominal slow rate of 3.6 V/us indicates the amplifier's response time and bandwidth capabilities, making it suitable for applications requiring precise signal processing and dynamic response.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27mm facilitates easy PCB layout and soldering, ensuring compatibility with industry-standard practices and assembly processes.

Technical Specifications

Operational Amplifiers (Op Amps) TLC271BIDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

4/16 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

1.7 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Minimum Common Mode Rejection Ratio (CMRR ):

65 dB

Input Offset Voltage Limit:

3500 uV

Minimum Voltage Gain:

10000

Nominal Slew Rate:

3.6 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

60 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

1.6 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLC271BIDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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