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TLC2654C-8DG4

Texas Instruments

TLC2654C-8DG4 by Texas Instruments

TLC2654C-8DG4 by Texas Instruments is an Op Amp with 34uV Max Input Offset Voltage, 125dB CMRR, and 1.3V/us Min Slew Rate. Ideal for precision applications requiring low bias current and high common mode rejection in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,724 parts In-Stock

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Digiode

USA . 1,192 parts In-Stock

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1,192

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Distributors (Availability)

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Parana Technologies

USA . 1,333 parts In-Stock

1+ parts

$3.472

100+ parts

-

1k+ parts

$3.997

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1,333

$3.472

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$3.997

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DigiPath Technology Company

USA . 1,346 parts In-Stock

1+ parts

$3.823

100+ parts

$3.517

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1,346

$3.823

$3.517

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ChromeModa Solutions

Germany . 1,666 parts In-Stock

1+ parts

$3.901

100+ parts

$3.199

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1,666

$3.901

$3.199

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IDEA Electronic Components Group

UK . 1,063 parts In-Stock

1+ parts

$3.901

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$3.511

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1,063

$3.901

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$3.511

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One Stop Electronics

USA . 1,591 parts In-Stock

1+ parts

$6.410

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1,591

$6.410

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AZTECH Wire

Italy . 741 parts In-Stock

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$14.170

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741

$14.170

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Component Stockers USA

USA . 710 parts In-Stock

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$99.990

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710

$99.990

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Corphita

USA . 4,372 parts In-Stock

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Microchip USA

USA . 1,343 parts In-Stock

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Overview

Unlock unparalleled performance and precision with the TLC2654C-8DG4 by Texas Instruments. As a leader in operational amplifiers, Texas Instruments delivers top-tier quality and reliability. Ideal for a wide range of applications, this op amp offers exceptional value with low offset, bias current, and high common-mode rejection ratio. Experience superior functionality and efficiency with the TLC2654C-8DG4, setting new standards in performance and versatility for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the components inside, ensuring longevity and reliability of the product.

Maximum Input Offset Voltage: 34 uV

Low input offset voltage allows for accurate signal amplification without distortion, making this product suitable for precision applications.

Maximum Average Bias Current (IIB): 0.00015 uA

Low bias current helps in minimizing power consumption and improving the signal fidelity of the amplifier.

Surface Mount: YES

Surface mount capability makes installation and integration of this operational amplifier easier in modern electronics manufacturing processes.

Nominal Common Mode Reject Ratio: 125 dB

High common mode rejection ratio ensures that any unwanted noise or interference in the input signal is greatly suppressed, leading to cleaner output signals.

Nominal Supply Voltage / Vsup (V): 5

Compatibility with a 5V supply voltage makes this operational amplifier suitable for a wide range of applications including portable and low-power devices.

Maximum Supply Voltage Limit: 8 V

With a supply voltage limit of 8V, this amplifier can withstand higher voltage inputs without risking damage to the internal components.

Minimum Slew Rate: 1.3 V/us

Fast slew rate enables the amplifier to respond quickly to changes in input signals, making it suitable for applications that require rapid signal processing.

Minimum Voltage Gain: 1000000

High voltage gain allows for signal amplification with minimal distortion, making this amplifier ideal for applications requiring precise voltage amplification.

Frequency Compensation: YES

Frequency compensation helps in stabilizing the amplifier's gain over a wide range of frequencies, ensuring consistent performance across different signal frequencies.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this operational amplifier energy-efficient and suitable for noise-sensitive applications.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this product is versatile and can be used in various analog signal processing applications such as amplification, filtering, and buffering.

Technical Specifications

Operational Amplifiers (Op Amps) TLC2654C-8DG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Chooper Stab

Technology:

CMOS

Power Supply:

±5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

Yes

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.9 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

125 dB

Minimum Common Mode Rejection Ratio (CMRR ):

105 dB

Input Offset Voltage Limit:

34 uV

Minimum Voltage Gain:

1000000

Minimum Slew Rate:

1.3 V/us

Nominal Slew Rate:

2 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

150 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

8 V

Maximum Negative Supply Voltage:

-5 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

2.5 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLC2654C-8DG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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