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TLC2274AMDR

Texas Instruments

TLC2274AMDR by Texas Instruments

TLC2274AMDR by Texas Instruments is a CMOS Operational Amplifier with 4 functions, 1500uV max input offset voltage, and 80dB nominal CMRR. Ideal for military-grade applications due to its low bias current of 0.00006uA @25C and wide temperature range from -55 to 125 °C. Suitable for precision signal conditioning in harsh environments.

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4

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1k+

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Chip Stock

USA . 30,930 parts In-Stock

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Vyrian

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Digiode

USA . 4,954 parts In-Stock

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QIE Inc.

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One Stop Electronics

USA . 1,249 parts In-Stock

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$4.410

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Parana Technologies

USA . 264 parts In-Stock

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$5.128

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DigiPath Technology Company

USA . 493 parts In-Stock

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$5.647

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$5.195

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ChromeModa Solutions

Germany . 6,281 parts In-Stock

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IDEA Electronic Components Group

UK . 1,888 parts In-Stock

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AZTECH Wire

Italy . 626 parts In-Stock

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A-Z Elektronik GmbH

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Overview

Experience superior performance with the Texas Instruments TLC2274AMDR operational amplifier, perfect for a wide range of applications. Designed with quality and precision in mind, this product offers unparalleled value to customers looking for reliability and efficiency in their projects. With advanced technology and innovative features, the TLC2274AMDR guarantees optimal results every time. Trust Texas Instruments to deliver top-notch products that meet and exceed your expectations. Choose the TLC2274AMDR for your next project and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the op amp, making it suitable for various environments.

Maximum Input Offset Voltage: 1500 uV

The low maximum input offset voltage ensures accurate and precise signal processing.

Surface Mount: YES

Being surface mountable makes installation and circuit board assembly easier and more efficient.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a nominal supply voltage of 5V, making it compatible with many standard power sources.

Minimum Slew Rate: 1.7 V/us

The minimum slew rate of 1.7 V/us allows for fast response and signal processing in dynamic applications.

Technology: CMOS

The CMOS technology offers low power consumption and high input impedance, making it energy-efficient and suitable for low-power applications.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this product is versatile and can be used in a wide range of applications such as signal conditioning, filtering, and amplification.

Maximum Supply Current: 6 mA

With a maximum supply current of 6 mA, this op amp is power-efficient and suitable for battery-powered applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLC2274AMDR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±2.2/±8/4.4/16 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

2.25 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Minimum Common Mode Rejection Ratio (CMRR ):

75 dB

Input Offset Voltage Limit:

1500 uV

Minimum Voltage Gain:

20000

Minimum Slew Rate:

1.7 V/us

Nominal Slew Rate:

3.6 V/us

Peak Bias Current:

800 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

8 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-8 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

6 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLC2274AMDR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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