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TLC2262AIDRG4

Texas Instruments

TLC2262AIDRG4 by Texas Instruments

TLC2262AIDRG4 by Texas Instruments is a dual operational amplifier with low bias current (0.0008 uA) and micropower feature. It operates at a wide temperature range (-40 to 125 °C) making it suitable for automotive applications. With high common mode rejection ratio (88 dB), it offers precise amplification in compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 50,150 parts In-Stock

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Vyrian

USA . 6,618 parts In-Stock

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6,618

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Digiode

USA . 3,443 parts In-Stock

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3,443

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Distributors (Availability)

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One Stop Electronics

USA . 885 parts In-Stock

1+ parts

$0.410

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885

$0.410

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Ampacity Inc.

Singapore . 864 parts In-Stock

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$6.410

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864

$6.410

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Parana Technologies

USA . 1,758 parts In-Stock

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$6.519

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$7.262

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Corohmni

South Africa . 8 parts In-Stock

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$6.915

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8

$6.915

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DigiPath Technology Company

USA . 914 parts In-Stock

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$7.178

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914

$7.178

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ChromeModa Solutions

Germany . 1,893 parts In-Stock

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$7.325

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$6.006

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$7.325

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IDEA Electronic Components Group

UK . 1,549 parts In-Stock

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$7.325

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$6.592

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AZTECH Wire

Italy . 723 parts In-Stock

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$13.306

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Argo Parts USA

USA . 4,203 parts In-Stock

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Microchip USA

USA . 2,298 parts In-Stock

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Continental Prestige Electronics

USA . 2,052 parts In-Stock

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Kepictronics

USA . 592 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 59 parts In-Stock

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59

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Overview

Experience superior performance and reliability with the Texas Instruments TLC2262AIDRG4 operational amplifier. Crafted with precision by a renowned manufacturer, this op amp offers unparalleled quality and versatility for a wide range of applications. From automotive to industrial settings, this compact yet powerful device delivers exceptional value by providing low bias current, micropower operation, and frequency compensation. Trust in the TLC2262AIDRG4 to enhance your designs and elevate your projects with its cutting-edge technology and reliable performance. Choose Texas Instruments for excellence that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the operational amplifier, ensuring a longer lifespan.

Maximum Input Offset Voltage: 1500 uV

Low input offset voltage helps in minimizing errors and inaccuracies in signal processing.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V makes it compatible with a wide range of applications and power sources.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this operational amplifier energy-efficient and reliable.

Nominal Unity Gain Bandwidth: 730 kHz

A high unity gain bandwidth ensures good frequency response and fast signal processing capabilities.

Technical Specifications

Operational Amplifiers (Op Amps) TLC2262AIDRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±2.2/±8/4.4/16 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

730 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

88 dB

Minimum Common Mode Rejection Ratio (CMRR ):

75 dB

Input Offset Voltage Limit:

1500 uV

Minimum Voltage Gain:

50000

Minimum Slew Rate:

0.25 V/us

Nominal Slew Rate:

0.55 V/us

Maximum Input Offset Current (IIO):

800 pA

Peak Bias Current:

800 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

8 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-8 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

500 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLC2262AIDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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