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TLC2254QDG4

Texas Instruments

TLC2254QDG4 by Texas Instruments

TLC2254QDG4 by Texas Instruments is a CMOS Operational Amplifier with 1750uV Max Input Offset Voltage, 88dB Nominal CMRR, and 210kHz Unity Gain Bandwidth. Ideal for automotive applications due to its low-bias, micropower design, and wide temperature range of -40 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,959 parts In-Stock

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7,959

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Digiode

USA . 1,704 parts In-Stock

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1,704

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Distributors (Availability)

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Parana Technologies

USA . 55 parts In-Stock

1+ parts

$4.356

100+ parts

-

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$4.772

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55

$4.356

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$4.772

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One Stop Electronics

USA . 788 parts In-Stock

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$4.410

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788

$4.410

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DigiPath Technology Company

USA . 1,438 parts In-Stock

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$4.796

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1,438

$4.796

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ChromeModa Solutions

Germany . 2,185 parts In-Stock

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$4.894

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$4.013

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2,185

$4.894

$4.013

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IDEA Electronic Components Group

UK . 493 parts In-Stock

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$4.894

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$4.405

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493

$4.894

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$4.405

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AZTECH Wire

Italy . 230 parts In-Stock

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$16.313

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230

$16.313

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QUARKTWIN TECHNOLOGY LTD

USA . 3,633 parts In-Stock

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Microchip USA

USA . 2,393 parts In-Stock

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Corphita

USA . 1,427 parts In-Stock

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Overview

Discover the exceptional performance and reliability of the TLC2254QDG4 by Texas Instruments, a leading manufacturer in operational amplifiers. This versatile component offers unmatched precision and efficiency for a wide range of applications in automotive, industrial, and consumer electronics. With its cutting-edge technology and low-bias design, this amplifier ensures superior operation and seamless integration. Elevate your projects with the TLC2254QDG4 and experience unparalleled quality and value like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability in various operating conditions.

Maximum Input Offset Voltage: 1750 uV

Low input offset voltage helps in minimizing errors in amplification.

Maximum Average Bias Current (IIB): 0.001 uA

Low bias current ensures minimal power consumption and accurate signal amplification.

Surface Mount: YES

Ease of installation and compact design for efficient use of space on a circuit board.

Nominal Common Mode Reject Ratio: 88 dB

High rejection of common mode signals for improved signal accuracy.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage for compatibility with a wide range of applications.

Maximum Supply Voltage Limit: 8 V

Adequate supply voltage limit for safe operation and flexibility in power supply options.

Maximum Operating Temperature: 125 °C

Wide operating temperature range for versatility in various environments.

Minimum Voltage Gain: 10000

High voltage gain for amplification of weak signals with minimal distortion.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Amplifier Type: OPERATIONAL AMPLIFIER

Specifically designed for signal amplification with high accuracy and stability.

Technical Specifications

Operational Amplifiers (Op Amps) TLC2254QDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±2.2/±8/4.4/16 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

210 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

88 dB

Input Offset Voltage Limit:

1750 uV

Minimum Voltage Gain:

10000

Minimum Slew Rate:

0.05 V/us

Nominal Slew Rate:

0.12 V/us

Peak Bias Current:

1 nA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

8 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-8 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

300 μA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLC2254QDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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