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TLC2254AQDRG4Q1

Texas Instruments

TLC2254AQDRG4Q1 by Texas Instruments

TLC2254AQDRG4Q1 by Texas Instruments is a CMOS Operational Amplifier with 1000uV Max Input Offset Voltage, 88dB Nominal CMRR, and 210kHz Unity Gain Bandwidth. Ideal for automotive applications due to AEC-Q100 screening level and low-bias micropower design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,453 parts In-Stock

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8,453

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Digiode

USA . 942 parts In-Stock

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942

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Distributors (Availability)

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Parana Technologies

USA . 1,670 parts In-Stock

1+ parts

$0.597

100+ parts

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$1.677

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1,670

$0.597

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$1.677

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DigiPath Technology Company

USA . 54 parts In-Stock

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$0.658

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54

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ChromeModa Solutions

Germany . 4,149 parts In-Stock

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$0.671

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$0.550

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4,149

$0.671

$0.550

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IDEA Electronic Components Group

UK . 345 parts In-Stock

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$0.671

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$0.604

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345

$0.671

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$0.604

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One Stop Electronics

USA . 1,021 parts In-Stock

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$1.410

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1,021

$1.410

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AZTECH Wire

Italy . 858 parts In-Stock

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$8.968

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858

$8.968

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Corphita

USA . 2,017 parts In-Stock

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Microchip USA

USA . 1,575 parts In-Stock

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Overview

Experience exceptional performance and reliability with the TLC2254AQDRG4Q1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality operational amplifiers like this one, designed for automotive applications. With low-bias technology and micropower capabilities, this op amp offers superior functionality and efficiency. Trust in Texas Instruments for cutting-edge solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the operational amplifier, ensuring long-term reliability.

Maximum Input Offset Voltage: 1000 uV

Low input offset voltage ensures accurate and precise amplification of signals.

Surface Mount: YES

Enables easy and efficient PCB assembly for streamlined manufacturing processes.

Nominal Common Mode Reject Ratio: 88 dB

High common mode rejection ratio helps in minimizing noise and interference in the amplified signals.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage, making it compatible with a wide range of applications.

Minimum Slew Rate: 0.05 V/us

Fast slew rate allows for rapid response to input signal changes, ideal for dynamic signal processing.

Frequency Compensation: YES

Provides stability and ensures consistent performance over a range of frequencies.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, making the operational amplifier energy-efficient and versatile.

Amplifier Type: OPERATIONAL AMPLIFIER

Specifically designed for amplifying input signals with high accuracy and linearity, suitable for various signal processing applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLC2254AQDRG4Q1 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±2.2/±8/4.4/16 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

210 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

88 dB

Input Offset Voltage Limit:

1000 uV

Minimum Voltage Gain:

10000

Minimum Slew Rate:

0.05 V/us

Nominal Slew Rate:

0.12 V/us

Peak Bias Current:

1 nA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

8 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-8 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

300 μA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Screening Level:

AEC-Q100

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLC2254AQDRG4Q1 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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