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TLC2252QPWRG4Q1

Texas Instruments

TLC2252QPWRG4Q1 by Texas Instruments

TLC2252QPWRG4Q1 by Texas Instruments is a dual operational amplifier with low bias current (0.00006 uA) and high common mode rejection ratio (83 dB). Ideal for automotive applications, it operates at temperatures ranging from -40 to 125 °C and features micropower technology. The package style is small outline, thin profile, shrink pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,695 parts In-Stock

1+ parts

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8,695

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Digiode

USA . 4,249 parts In-Stock

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4,249

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 153 parts In-Stock

1+ parts

$2.881

100+ parts

-

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$3.373

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153

$2.881

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$3.373

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DigiPath Technology Company

USA . 1,632 parts In-Stock

1+ parts

$3.172

100+ parts

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1,632

$3.172

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ChromeModa Solutions

Germany . 4,041 parts In-Stock

1+ parts

$3.237

100+ parts

$2.654

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4,041

$3.237

$2.654

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IDEA Electronic Components Group

UK . 2,156 parts In-Stock

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$3.237

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$2.913

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2,156

$3.237

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$2.913

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One Stop Electronics

USA . 1,057 parts In-Stock

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$6.410

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1,057

$6.410

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AZTECH Wire

Italy . 299 parts In-Stock

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$13.428

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299

$13.428

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Corphita

USA . 4,565 parts In-Stock

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4,565

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Microchip USA

USA . 1,641 parts In-Stock

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Overview

Enhance your automotive electronics with the TLC2252QPWRG4Q1 operational amplifier from Texas Instruments. Designed with precision and reliability in mind, this high-quality component offers low bias current, micropower capabilities, and compact packaging for a wide range of applications. Whether you're working on sensor interfaces, voltage regulators, or signal conditioning circuits, this AEC-Q100 screened op amp delivers exceptional performance and efficiency. Trust Texas Instruments for cutting-edge technology that exceeds your expectations. Elevate your designs with the TLC2252QPWRG4Q1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, suitable for various applications.

Maximum Input Offset Voltage: 1500 uV

The low maximum input offset voltage ensures high accuracy in signal processing, making this product ideal for precision applications.

Maximum Average Bias Current (IIB): 0.00006 uA

The low bias current minimizes power consumption and distortion in the output signal, enhancing overall performance.

Surface Mount: YES

Being surface mountable makes installation and integration of this product easier, saving time and effort in the assembly process.

Nominal Common Mode Reject Ratio: 83 dB

The high common mode reject ratio ensures effective rejection of noise and interference, leading to a clean output signal in noisy environments.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with a wide range of systems and power sources.

Minimum Slew Rate: 0.05 V/us

The fast slew rate allows for quick and precise response to input signal changes, improving the dynamic performance of the amplifier.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, ensuring reliable performance in harsh operating conditions commonly found in automotive applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high input impedance, and rail-to-rail output swing characteristics for efficient and versatile operation.

Technical Specifications

Operational Amplifiers (Op Amps) TLC2252QPWRG4Q1 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±8/2.7/16 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

200 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

83 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

1500 uV

Minimum Voltage Gain:

10000

Minimum Slew Rate:

0.05 V/us

Nominal Slew Rate:

0.12 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

60 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

8 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-8 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

125 μA

Physical Characteristics

Length:

0.173 in (4.4 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Screening Level:

AEC-Q100

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.25

Trade Compliance

TLC2252QPWRG4Q1 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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