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TLC2201ACDRG4

Texas Instruments

TLC2201ACDRG4 by Texas Instruments

TLC2201ACDRG4 by Texas Instruments is an Operational Amplifier with low-offset and low-bias features. It has a max input offset voltage of 300uV, nominal common mode reject ratio of 115dB, and min slew rate of 1.5V/us. Ideal for applications requiring precise signal amplification in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,538 parts In-Stock

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Digiode

USA . 3,042 parts In-Stock

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3,042

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Semi Source

USA . 67 parts In-Stock

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67

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One Stop Electronics

USA . 595 parts In-Stock

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$1.410

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595

$1.410

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Parana Technologies

USA . 1,288 parts In-Stock

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$1.983

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$184.144

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$1.785

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1,288

$1.983

$184.144

$1.785

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DigiPath Technology Company

USA . 209 parts In-Stock

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$2.183

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$2.009

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IDEA Electronic Components Group

UK . 1,185 parts In-Stock

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$2.228

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$2.005

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$2.228

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ChromeModa Solutions

Germany . 305 parts In-Stock

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$2.228

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$1.827

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305

$2.228

$1.827

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AZTECH Wire

Italy . 824 parts In-Stock

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$19.650

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Lixinc

USA . 15,795 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Microchip USA

USA . 1,965 parts In-Stock

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Corphita

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Overview

Experience unmatched precision and reliability with the TLC2201ACDRG4 by Texas Instruments, a leading name in operational amplifiers. Ideal for a wide range of applications, this small-outline op amp offers a high voltage gain bandwidth, low bias current, and exceptional common mode rejection ratio. With its advanced technology and commercial-grade temperature range, this amplifier ensures optimal performance in any environment. Trust Texas Instruments to deliver top-quality solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the operational amplifier, ensuring longevity and reliable performance.

Maximum Input Offset Voltage: 300 uV

Low input offset voltage helps in minimizing errors in signal amplification and ensures accurate output.

Nominal Unity Gain Bandwidth: 1900 kHz

High unity gain bandwidth allows for high-speed signal processing and amplification, making this operational amplifier suitable for applications requiring fast response times.

Nominal Common Mode Reject Ratio: 115 dB

High common mode rejection ratio helps in reducing noise and interference from common-mode signals, resulting in cleaner output signals.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, making this operational amplifier energy-efficient and suitable for battery-powered applications.

Surface Mount: YES

Surface mount package makes installation and PCB assembly easier and more efficient, saving time and effort during production.

Technical Specifications

Operational Amplifiers (Op Amps) TLC2201ACDRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±2.3/±8/4.6/16 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

Yes

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.9 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

115 dB

Minimum Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

300 uV

Minimum Voltage Gain:

70000

Minimum Slew Rate:

1.5 V/us

Nominal Slew Rate:

2.7 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

100 pA

Maximum Bias Current (IIB) @25 °C:

100 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

8 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-8 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

1.5 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLC2201ACDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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