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TLC0831IDRG4

Texas Instruments

TLC0831IDRG4 by Texas Instruments

TLC0831IDRG4 by Texas Instruments is an 8-bit ADC with a 0-5V analog input range, 0.25 MHz sample rate, and 32us conversion time. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact SMD package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,510 parts In-Stock

1+ parts

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2,510

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Digiode

USA . 134 parts In-Stock

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134

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 457 parts In-Stock

1+ parts

$4.000

100+ parts

-

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457

$4.000

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Parana Technologies

USA . 1,651 parts In-Stock

1+ parts

$14.996

100+ parts

-

1k+ parts

$15.420

10k+ parts

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1,651

$14.996

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$15.420

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DigiPath Technology Company

USA . 1,304 parts In-Stock

1+ parts

$16.513

100+ parts

$15.192

1k+ parts

-

10k+ parts

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1,304

$16.513

$15.192

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ChromeModa Solutions

Germany . 4,884 parts In-Stock

1+ parts

$16.850

100+ parts

$13.817

1k+ parts

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10k+ parts

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4,884

$16.850

$13.817

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IDEA Electronic Components Group

UK . 1,184 parts In-Stock

1+ parts

$16.850

100+ parts

$16.008

1k+ parts

$15.165

10k+ parts

-

1,184

$16.850

$16.008

$15.165

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AZTECH Wire

Italy . 446 parts In-Stock

1+ parts

$16.960

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446

$16.960

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A-Z Elektronik GmbH

Germany . 5,012 parts In-Stock

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5,012

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Corphita

USA . 3,648 parts In-Stock

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Microchip USA

USA . 1,818 parts In-Stock

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1,818

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Overview

Discover the unparalleled precision and reliability of the Texas Instruments TLC0831IDRG4 Analog-to-Digital Converter. Manufactured by industry leader Texas Instruments, this small outline package converter offers a wide range of applications in industrial settings. With a high sample rate and low power consumption, this converter provides exceptional value for customers seeking high-performance solutions. Upgrade your project with the TLC0831IDRG4 and experience superior quality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the product.

No. of Bits: 8

8-bit resolution provides sufficient accuracy for most analog-to-digital conversion tasks.

Power Supplies (V): 5

Operates at a standard 5V power supply, making it compatible with many systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Output Bit Code: BINARY

Binary output simplifies data processing and interfacing with digital systems.

Technical Specifications

Analog-to-Digital Converters TLC0831IDRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Sample Rate:

250 kHz

Maximum Conversion Time:

32 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

4.5 V

Maximum Supply Current:

4.7 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP8,.25

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC0831IDRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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