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TLC0831CDR

Texas Instruments

TLC0831CDR by Texas Instruments

TLC0831CDR by Texas Instruments is an 8-bit ADC with a 5V supply, 32us conversion time, and 0.031 MHz sample rate. Ideal for commercial applications, it features a small outline package and operates b/w 0-70°C. With binary output format and CMOS technology, it suits various analog-to-digital conversion needs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,531 parts In-Stock

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3,531

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Digiode

USA . 689 parts In-Stock

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689

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Distributors (Availability)

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One Stop Electronics

USA . 439 parts In-Stock

1+ parts

$8.000

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439

$8.000

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Parana Technologies

USA . 1,752 parts In-Stock

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$9.948

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-

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$10.512

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1,752

$9.948

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$10.512

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ChromeModa Solutions

Germany . 3,904 parts In-Stock

1+ parts

$11.177

100+ parts

$9.165

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3,904

$11.177

$9.165

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IDEA Electronic Components Group

UK . 195 parts In-Stock

1+ parts

$11.177

100+ parts

$10.618

1k+ parts

$10.059

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195

$11.177

$10.618

$10.059

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AZTECH Wire

Italy . 787 parts In-Stock

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$16.787

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787

$16.787

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Microchip USA

USA . 2,763 parts In-Stock

1+ parts

$18.010

100+ parts

$17.900

1k+ parts

$17.850

10k+ parts

$17.790

2,763

$18.010

$17.900

$17.850

$17.790

QUARKTWIN TECHNOLOGY LTD

USA . 13,454 parts In-Stock

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Kepictronics

USA . 3,300 parts In-Stock

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Corphita

USA . 2,844 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,310 parts In-Stock

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2,310

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DigiPath Technology Company

USA . 1,151 parts In-Stock

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$10.077

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$10.077

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Overview

Experience the superior quality and precision of Texas Instruments with the TLC0831CDR Analog-to-Digital Converter. This versatile device offers fast conversion time and a small outline package style, making it perfect for a wide range of applications. Whether you're designing IoT devices, medical equipment, or industrial automation systems, this ADC provides reliable performance and accuracy. Trust in Texas Instruments to deliver cutting-edge technology that meets your demands for efficiency and excellence. Elevate your projects with the TLC0831CDR and experience the value it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, which is ideal for portable and rugged applications.

Surface Mount: YES

Being surface mountable allows for easy installation on circuit boards, making it suitable for mass production and compact designs.

No. of Bits: 8

Having 8 bits provides a decent level of resolution for converting analog signals to digital values accurately.

Power Supplies (V): 5

Operating at 5V makes it compatible with standard power sources, simplifying the design and integration process.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this ADC can reliably operate in various environmental conditions without risk of damage.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making it energy efficient and reliable for signal conversion.

Sample Rate: 0.031 MHz

The high sample rate of 0.031 MHz allows for quick and precise conversion of analog signals to digital data, suitable for dynamic applications.

Technical Specifications

Analog-to-Digital Converters TLC0831CDR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Sample Rate:

31 kHz

Maximum Conversion Time:

32 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

4.5 V

Maximum Supply Current:

4.7 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP8,.25

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC0831CDR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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