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TLC0831CDG4

Texas Instruments

TLC0831CDG4 by Texas Instruments

TLC0831CDG4 by Texas Instruments is an 8-bit ADC with a 0-5V analog input range, 0.25 MHz sample rate, and 32us conversion time. Ideal for commercial applications requiring small outline packages, it operates b/w 0-70°C and consumes 4.7mA at a nominal voltage of 5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,673 parts In-Stock

1+ parts

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8,673

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Digiode

USA . 2,141 parts In-Stock

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2,141

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 603 parts In-Stock

1+ parts

$12.636

100+ parts

-

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603

$12.636

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One Stop Electronics

USA . 294 parts In-Stock

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$15.000

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-

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294

$15.000

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Parana Technologies

USA . 833 parts In-Stock

1+ parts

$19.251

100+ parts

$1,787.720

1k+ parts

$17.326

10k+ parts

-

833

$19.251

$1,787.720

$17.326

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DigiPath Technology Company

USA . 633 parts In-Stock

1+ parts

$21.197

100+ parts

$19.502

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-

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633

$21.197

$19.502

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IDEA Electronic Components Group

UK . 1,561 parts In-Stock

1+ parts

$21.630

100+ parts

$20.548

1k+ parts

$19.467

10k+ parts

-

1,561

$21.630

$20.548

$19.467

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ChromeModa Solutions

Germany . 1,352 parts In-Stock

1+ parts

$21.630

100+ parts

$17.737

1k+ parts

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1,352

$21.630

$17.737

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QUARKTWIN TECHNOLOGY LTD

USA . 23,440 parts In-Stock

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Microchip USA

USA . 10,591 parts In-Stock

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Corphita

USA . 2,552 parts In-Stock

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2,552

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Overview

Experience the precision and reliability of the TLC0831CDG4 Analog-to-Digital Converter by Texas Instruments. Designed with top-quality materials and advanced technology, this small outline package offers a quick conversion time and binary output for a wide range of applications. Whether you're in the medical, automotive, or industrial field, this converter provides accurate data collection and analysis, making it a valuable tool for your projects. Trust in Texas Instruments for superior performance and unlock endless possibilities with the TLC0831CDG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and resistant to environmental factors, making the product suitable for a wide range of applications.

No. of Bits: 8

8-bit resolution provides a good balance between accuracy and cost efficiency for many applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can perform reliably in a variety of environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy efficient and reliable.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Successive approximation ADCs are known for their high speed and accuracy, making this product suitable for applications that require precise analog-to-digital conversion.

Technical Specifications

Analog-to-Digital Converters TLC0831CDG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Sample Rate:

250 kHz

Maximum Conversion Time:

32 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

4.5 V

Maximum Supply Current:

4.7 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP8,.25

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC0831CDG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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