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TLC0820ACDWG4

Texas Instruments

TLC0820ACDWG4 by Texas Instruments

TLC0820ACDWG4 by Texas Instruments is an 8-bit ADC with 0.3906% linearity error, 5V power supply, and 0.4 MHz sample rate. Ideal for applications requiring fast conversion times and precise analog-to-digital conversion in commercial temperature environments. Package style is small outline with gull wing terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,517 parts In-Stock

1+ parts

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8,517

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Digiode

USA . 2,548 parts In-Stock

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2,548

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 759 parts In-Stock

1+ parts

$11.430

100+ parts

-

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759

$11.430

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Parana Technologies

USA . 368 parts In-Stock

1+ parts

$17.670

100+ parts

-

1k+ parts

$17.859

10k+ parts

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368

$17.670

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$17.859

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DigiPath Technology Company

USA . 522 parts In-Stock

1+ parts

$19.457

100+ parts

$17.900

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522

$19.457

$17.900

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ChromeModa Solutions

Germany . 6,828 parts In-Stock

1+ parts

$19.854

100+ parts

$16.280

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6,828

$19.854

$16.280

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IDEA Electronic Components Group

UK . 716 parts In-Stock

1+ parts

$19.854

100+ parts

$18.861

1k+ parts

$17.869

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716

$19.854

$18.861

$17.869

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One Stop Electronics

USA . 323 parts In-Stock

1+ parts

$20.000

100+ parts

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323

$20.000

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Component Stockers USA

USA . 430 parts In-Stock

1+ parts

$99.990

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430

$99.990

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Corphita

USA . 3,461 parts In-Stock

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3,461

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Microchip USA

USA . 1,768 parts In-Stock

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1,768

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Overview

Unlock the power of precise analog-to-digital conversion with the TLC0820ACDWG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that guarantee reliability and accuracy. The TLC0820ACDWG4 is perfect for a wide range of applications, offering customers unmatched value and performance. Experience seamless operation and fast conversion times with this high-quality ADC, making it an essential component for any project. Elevate your designs with the TLC0820ACDWG4 and trust in Texas Instruments for exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for the product.

Surface Mount: YES

Facilitates easy installation and space-saving on circuit boards.

No. of Bits: 8

Offers sufficient resolution for accurate analog-to-digital conversion.

Maximum Linearity Error (EL): 0.3906 %

Ensures high accuracy in conversion results.

Power Supplies (V): 5

Operates efficiently with a commonly available voltage.

No. of Terminals: 20

Provides ample connectivity options for various applications.

Minimum Supply Voltage: 4.5 V

Allows for flexibility in power input while maintaining functionality.

Package Style (Meter): SMALL OUTLINE

Optimizes space usage and enhances portability.

Maximum Conversion Time: 2.5 us

Enables quick conversion of analog signals to digital output.

Maximum Analog Input Voltage: 8.1 V

Handles a wide range of analog input signals for versatile usage.

Technical Specifications

Analog-to-Digital Converters TLC0820ACDWG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits

Maximum Linearity Error (EL):

0.3906 %

Sample Rate:

400 kHz

Hold Mode:

Track

Maximum Conversion Time:

2.5 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

-100 mV

Maximum Analog Input Voltage:

8.1 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

4.5 V

Maximum Supply Current:

15 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC0820ACDWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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