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TL820MJ/883B

Texas Instruments

TL820MJ/883B by Texas Instruments

TL820MJ/883B by Texas Instruments is a MIL-STD-883 Class B (Modified) comparator with 14 terminals. It operates in temperatures ranging from -55°C to 125°C, making it suitable for military-grade applications. The package style is in-line rectangular ceramic, utilizing bipolar technology for precise through-hole terminal connections.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,374 parts In-Stock

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Digiode

USA . 2,144 parts In-Stock

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Sinequanon

UK . 12 parts In-Stock

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Parana Technologies

USA . 1,156 parts In-Stock

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$3.232

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$3.755

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$3.232

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DigiPath Technology Company

USA . 279 parts In-Stock

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$3.559

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279

$3.559

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ChromeModa Solutions

Germany . 6,697 parts In-Stock

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$3.632

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$2.978

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6,697

$3.632

$2.978

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IDEA Electronic Components Group

UK . 1,630 parts In-Stock

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$3.632

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$3.269

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$3.632

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AZTECH Wire

Italy . 581 parts In-Stock

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$5.326

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$5.326

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One Stop Electronics

USA . 1,220 parts In-Stock

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$5.410

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Corphita

USA . 1,229 parts In-Stock

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Overview

Immerse yourself in the world of precision with the TL820MJ/883B by Texas Instruments. As a trusted name in the industry, Texas Instruments delivers top-notch quality and reliability. This comparator is perfect for applications requiring precise voltage comparisons in harsh environments, thanks to its MIL-STD-883 Class B screening level. With military-grade temperature tolerance and bipolar technology, this product ensures peak performance in any situation. Trust Texas Instruments to provide you with the cutting-edge technology you need for your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package ensures high reliability and durability, making it suitable for military-grade applications.

Screening Level: MIL-STD-883 Class B (Modified)

Complies with rigorous military standards for quality control and testing, ensuring consistent performance in demanding environments.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient layout and integration into electronic circuits.

No. of Terminals: 14

Sufficient number of terminals for connecting to external components and circuitry.

Package Style (Meter): IN-LINE

In-line package style allows for easy mounting and soldering onto circuit boards.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures without compromising performance.

Minimum Operating Temperature: -55 °C

Capable of operating at low temperatures, suitable for a wide range of environmental conditions.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and layout.

Technology: BIPOLAR

Bipolar technology offers high speed and accuracy in signal comparison applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections to circuit boards.

Amplifier Type: COMPARATOR

Designed specifically for signal comparison tasks, ensuring accurate and reliable results.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy integration into existing circuit designs.

Technical Specifications

Comparators TL820MJ/883B attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Sub-Category:

Comparators

Operational Characteristics

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Physical Characteristics

Total Terminals:

14

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Ceramic

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Screening Level:

MIL-STD-883 Class B (Modified)

Standards

JESD-30 Code:

R-XDIP-T14

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Type:

In-Line

Package Equivalence Code:

DIP14,.3

Trade Compliance

TL820MJ/883B Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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