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TL593MJ

Texas Instruments

TL593MJ by Texas Instruments

TL593MJ by Texas Instruments is a dual switching controller with voltage-mode control. It operates in temperatures ranging from -55°C to 125°C, making it suitable for military-grade applications. The IC features 16 terminals in an in-line rectangular ceramic package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,670 parts In-Stock

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7,670

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Digiode

USA . 1,974 parts In-Stock

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1,974

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Semicontronic

India . 893 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

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$0.485

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893

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 1,549 parts In-Stock

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$4.500

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1,549

$4.500

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One Stop Electronics

USA . 840 parts In-Stock

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$4.500

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840

$4.500

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Parana Technologies

USA . 1,101 parts In-Stock

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$18.165

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$18.306

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1,101

$18.165

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$18.306

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AZTECH Wire

Italy . 828 parts In-Stock

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$19.244

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828

$19.244

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DigiPath Technology Company

USA . 245 parts In-Stock

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$20.002

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$18.402

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245

$20.002

$18.402

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ChromeModa Solutions

Germany . 6,340 parts In-Stock

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$20.410

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$16.736

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6,340

$20.410

$16.736

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IDEA Electronic Components Group

UK . 442 parts In-Stock

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$20.410

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$19.390

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$18.369

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442

$20.410

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$18.369

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Corphita

USA . 2,808 parts In-Stock

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Corohmni

South Africa . 375 parts In-Stock

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Overview

Elevate your power management solutions with the TL593MJ by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge Switching Regulators & Controllers that cater to a wide range of applications. The TL593MJ stands out for its MILITARY-grade temperature capabilities, making it ideal for demanding environments. With its innovative VOLTAGE-MODE control mode and dual switching controller design, this product offers exceptional value and performance. Trust Texas Instruments to provide you with the best power management solutions in the market.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity, making this product suitable for applications where heat dissipation is important.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on a circuit board, making this product ideal for compact designs.

No. of Terminals: 16

Having 16 terminals allows for more connectivity options and flexibility in circuit design, making this product versatile.

Package Style (Meter): IN-LINE

In-line package style is commonly used and easy to integrate into existing circuit layouts, making this product user-friendly.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh operating conditions, ensuring reliability.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers precise regulation of output voltage, making this product suitable for applications that require stable power supply.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature allows for operation in cold environments, increasing the versatility of this product.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved reliability in connections, making this product a dependable choice.

Other IC type: DUAL SWITCHING CONTROLLER

Being a dual switching controller enables this product to handle multiple power outputs efficiently, offering more flexibility in design.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures that this product can perform reliably in extreme conditions, making it suitable for aerospace or defense applications.

Technology: BIPOLAR

Bipolar technology offers high power conversion efficiency and fast response times, making this product energy-efficient and responsive.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, enhancing durability and making this product suitable for rugged environments.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm ensures compatibility with commonly used connectors and sockets, making integration easier for users.

Technical Specifications

Switching Regulators & Controllers TL593MJ attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

R-XDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TL593MJ Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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