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TL5001MJG

Texas Instruments

TL5001MJG by Texas Instruments

TL5001MJG by Texas Instruments is a voltage-mode switching controller with 8 terminals. It operates b/w -55 to 125°C, supporting input voltages from 3.6V to 40V and output voltages ranging from 1V to 50V. Ideal for military-grade applications, it utilizes pulse width modulation control technique with a max output current of 0.1A at a frequency of up to 400kHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,471 parts In-Stock

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Digiode

USA . 1,197 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,318 parts In-Stock

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$2.500

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1,318

$2.500

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Ampacity Inc.

Singapore . 1,103 parts In-Stock

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$2.500

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$2.500

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Semicontronic

India . 1,289 parts In-Stock

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$6.500

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$6.338

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$6.305

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$6.305

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AZTECH Wire

Italy . 692 parts In-Stock

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$10.415

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692

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Parana Technologies

USA . 2,164 parts In-Stock

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$19.438

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$19.450

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$19.438

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$19.450

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DigiPath Technology Company

USA . 62 parts In-Stock

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$21.404

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62

$21.404

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IDEA Electronic Components Group

UK . 2,169 parts In-Stock

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$21.841

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$20.749

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$19.657

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2,169

$21.841

$20.749

$19.657

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ChromeModa Solutions

Germany . 1,004 parts In-Stock

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$21.841

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$17.910

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$21.841

$17.910

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Microchip USA

USA . 4,774 parts In-Stock

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Corphita

USA . 3,313 parts In-Stock

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Corohmni

South Africa . 121 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the TL5001MJG Switching Regulator & Controller. This versatile component offers precise voltage control in a compact package, making it ideal for a wide range of applications. With a military-grade temperature rating and advanced control techniques, this product ensures optimal performance even in the most demanding environments. Trust in Texas Instruments to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides excellent durability and protection for the internal components, ensuring long-term reliability.

Minimum Output Voltage: 1 V

Allows for precise control and regulation of output voltage, suitable for a wide range of applications.

Maximum Output Voltage: 50 V

Offers a high output voltage capability, making it versatile for various power supply requirements.

Maximum Operating Temperature: 125 °C

Can operate in high temperature environments, ideal for industrial or harsh conditions.

Maximum Switching Frequency: 400 kHz

Enables fast and efficient power conversion, reducing energy losses and heat generation.

Control Technique: PULSE WIDTH MODULATION

PWM control provides precise and stable regulation of output voltage, ensuring reliable performance.

Technical Specifications

Switching Regulators & Controllers TL5001MJG attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

40 V

Minimum Input Voltage:

3.6 V

Nominal Input Voltage:

6 V

JESD-30 Code:

R-GDIP-T8

JESD-609 Code:

e0

Length:

9.58 mm

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

.1 A

Maximum Output Voltage:

50 V

Minimum Output Voltage:

1 V

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Surface Mount:

NO

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

400 kHz

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

TL5001MJG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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