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TL1451ACDB

Texas Instruments

TL1451ACDB by Texas Instruments

TL1451ACDB by Texas Instruments is a voltage-mode dual switching controller with a max output current of 0.021A and a max switching frequency of 500kHz. This CMOS technology device operates b/w -20 to 85°C, making it ideal for small outline applications requiring precise voltage control in the range of 3.6V to 50V.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Bristol Electronics

USA . 3,174 parts In-Stock

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Digiode

USA . 2,455 parts In-Stock

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Vyrian

USA . 1,975 parts In-Stock

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LWI Electronics Inc

India . 1 parts In-Stock

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Parana Technologies

USA . 1,190 parts In-Stock

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$6.436

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$7.180

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$6.436

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DigiPath Technology Company

USA . 1,113 parts In-Stock

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$7.086

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$6.519

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ChromeModa Solutions

Germany . 6,897 parts In-Stock

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$7.231

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$5.929

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IDEA Electronic Components Group

UK . 2,378 parts In-Stock

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$7.231

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$6.508

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One Stop Electronics

USA . 882 parts In-Stock

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$7.500

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AZTECH Wire

Italy . 226 parts In-Stock

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$14.287

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GreenTree Electronics

Israel . 11,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,696 parts In-Stock

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Corphita

USA . 4,645 parts In-Stock

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Kepictronics

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Assy Fe

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Unlock the full potential of your power management system with the TL1451ACDB by Texas Instruments. Known for their high-quality products, Texas Instruments delivers top-notch switching regulators & controllers that are versatile and reliable. The TL1451ACDB is designed to provide efficient voltage regulation with a wide input voltage range, making it suitable for a variety of applications. With its compact design and advanced control mode, this dual switching controller offers exceptional performance while ensuring low power consumption. Experience the difference with Texas Instruments and take your power management to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is durable and helps protect the internal components of the switching regulator, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and reducing assembly time.

No. of Terminals: 16

Having 16 terminals provides flexibility for connecting to various external components and peripherals.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this switching regulator suitable for use in a wide range of environments and applications.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers precise regulation of the output voltage, ensuring stable and reliable performance.

Technology: CMOS

CMOS technology provides low power consumption and high efficiency, making the switching regulator energy-efficient.

Technical Specifications

Switching Regulators & Controllers TL1451ACDB attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

50 V

Minimum Input Voltage:

3.6 V

Nominal Input Voltage:

6 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

.021 A

Nominal Output Voltage:

2.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Maximum Supply Current (Isup):

2.4 mA

Surface Mount:

YES

Switcher Config:

PHASE-SHIFT

Maximum Switching Frequency:

500 kHz

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.3 mm

Trade Compliance

TL1451ACDB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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