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TL1431CDRG4

Texas Instruments

TL1431CDRG4 by Texas Instruments

TL1431CDRG4 by Texas Instruments is a voltage reference IC with adjustable output (2.49-2.51V) and 100mA max output current. It's a small outline package suitable for applications requiring precise voltage regulation, such as power supplies and battery management systems. Operating temperature range is 0-70°C.

Median Price

$0.217

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 23 parts In-Stock

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$0.217

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Chip Stock

USA . 33,600 parts In-Stock

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Vyrian

USA . 8,238 parts In-Stock

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Digiode

USA . 4,952 parts In-Stock

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Inventory MP

USA . 1,701 parts In-Stock

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Bristol Electronics

USA . 1,701 parts In-Stock

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One Stop Electronics

USA . 280 parts In-Stock

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$0.500

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280

$0.500

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Parana Technologies

USA . 261 parts In-Stock

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$8.565

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$9.225

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261

$8.565

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$9.225

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DigiPath Technology Company

USA . 1,679 parts In-Stock

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$9.432

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1,679

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ChromeModa Solutions

Germany . 3,364 parts In-Stock

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$9.624

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$7.892

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3,364

$9.624

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IDEA Electronic Components Group

UK . 998 parts In-Stock

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$9.624

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$9.143

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$8.662

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998

$9.624

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$8.662

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AZTECH Wire

Italy . 712 parts In-Stock

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$15.753

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Perfect Parts

USA . 2,500 parts In-Stock

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Corphita

USA . 852 parts In-Stock

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Kepictronics

USA . 314 parts In-Stock

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Overview

Discover the reliability and precision of the TL1431CDRG4 voltage reference by Texas Instruments. With a commitment to quality, Texas Instruments delivers cutting-edge technology in a compact package. This versatile product is ideal for a wide range of applications, offering customers consistent performance and peace of mind. Experience the value and benefits of this innovative voltage reference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and resistant to external impacts, ensuring durability.

Surface Mount: YES

Being surface mount compatible allows for easy integration into circuit boards, saving space and simplifying the assembly process.

Trim or Adjustable Output (V): YES

The ability to trim or adjust the output voltage allows for fine-tuning to meet specific requirements of the application.

Nominal Supply Voltage (Vsup): 2.5 V

The nominal supply voltage of 2.5V ensures compatibility with a wide range of electronic devices and systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand high temperature environments, offering reliability in various applications.

Minimum Output Voltage: 2.49 V

The minimum output voltage of 2.49V ensures stable and precise voltage regulation for critical circuits.

Technology: BIPOLAR

The use of bipolar technology ensures high accuracy and stability in voltage references, making it suitable for sensitive electronic systems.

Technical Specifications

Voltage References TL1431CDRG4 attributes and parameters. Explore more Voltage References devices from Texas Instruments

Specs

Additional Features:

OUTPUT VOLTAGE ADJUSTABLE FROM 2.5V TO 36V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

.1 A

Maximum Output Voltage:

2.51 V

Minimum Output Voltage:

2.49 V

Nominal Output Voltage:

2.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Voltage References

Maximum Supply Current (Isup):

100 mA

Maximum Supply Voltage (Vsup):

36 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Max Voltage Temp Coef:

114 ppm/Cel

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trim or Adjustable Output (V):

YES

Maximum Voltage Tolerance:

.4 %

Width (mm):

3.9 mm

Trade Compliance

TL1431CDRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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