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TL094CN3

Texas Instruments

TL094CN3 by Texas Instruments

TL094CN3 by Texas Instruments is a 14-terminal operational amplifier with 4 functions. It features a max input offset voltage of 20000 uV and operates on power supplies of 5/+-15 V. Ideal for applications requiring low-bias, high voltage gain, and frequency compensation in commercial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,754 parts In-Stock

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7,754

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Digiode

USA . 4,277 parts In-Stock

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4,277

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 452 parts In-Stock

1+ parts

$1.410

100+ parts

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452

$1.410

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Parana Technologies

USA . 2,091 parts In-Stock

1+ parts

$5.026

100+ parts

$466.725

1k+ parts

$4.523

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-

2,091

$5.026

$466.725

$4.523

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DigiPath Technology Company

USA . 278 parts In-Stock

1+ parts

$5.534

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278

$5.534

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ChromeModa Solutions

Germany . 5,896 parts In-Stock

1+ parts

$5.647

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$4.631

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5,896

$5.647

$4.631

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IDEA Electronic Components Group

UK . 1,721 parts In-Stock

1+ parts

$5.647

100+ parts

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$5.082

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1,721

$5.647

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$5.082

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AZTECH Wire

Italy . 352 parts In-Stock

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$17.984

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352

$17.984

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Corphita

USA . 2,221 parts In-Stock

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Overview

Enhance your electronic designs with the TL094CN3 from Texas Instruments, a top-quality operational amplifier that delivers precision and reliability. Crafted by the trusted manufacturer, this component offers exceptional performance in a wide range of applications. Whether you're working on audio equipment, control systems, or instrumentation, this Op Amp's low bias current, high voltage gain, and frequency compensation will elevate your project to new heights. Trust in Texas Instruments for superior quality and get the competitive edge you need with the TL094CN3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides durability and reliability for the product, ensuring a longer lifespan.

Maximum Input Offset Voltage: 20000 uV

The high input offset voltage allows for accurate signal processing and amplification.

No. of Functions: 4

Having multiple functions in one component increases the versatility and efficiency of the product.

Power Supplies (V): 5/+-15

The wide range of power supplies supported allows for compatibility with various systems and applications.

No. of Terminals: 14

More terminals provide flexibility in connection options and functionality.

Maximum Operating Temperature: 70 °C

The high operating temperature range ensures stable performance in a variety of environments.

Frequency Compensation: YES

Frequency compensation helps in maintaining stability and improving response time in signal processing.

Minimum Voltage Gain: 15000

High voltage gain allows for better amplification of weak input signals.

Temperature Grade: COMMERCIAL

Commercial grade components are suitable for standard non-critical applications, offering a cost-effective solution.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are known for their high gain and precision, making them ideal for various signal processing tasks.

Technical Specifications

Operational Amplifiers (Op Amps) TL094CN3 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Power Supply:

5/±15 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Performance Specifications

Input Offset Voltage Limit:

20000 uV

Minimum Voltage Gain:

15000

Maximum Input Offset Current (IIO):

5 nA

Maximum Bias Current (IIB) @25 °C:

400 pA

Operational Characteristics

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Maximum Supply Current:

10 mA

Physical Characteristics

Total Terminals:

14

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Standards

JESD-30 Code:

R-PDIP-T14

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Style:

In Line

Package Equivalence Code:

DIP14,.3

Trade Compliance

TL094CN3 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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