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TL084QDG4

Texas Instruments

TL084QDG4 by Texas Instruments

TL084QDG4 by Texas Instruments is a quad operational amplifier with 4 functions, featuring low-bias current (0.05 uA) and high common mode rejection ratio (86 dB). Ideal for automotive applications due to its wide temperature range (-40 to 125 °C) and small outline package style.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 2,920 parts In-Stock

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Digiode

USA . 2,184 parts In-Stock

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One Stop Electronics

USA . 251 parts In-Stock

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$4.410

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251

$4.410

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Parana Technologies

USA . 888 parts In-Stock

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$5.695

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$6.487

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888

$5.695

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$6.487

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DigiPath Technology Company

USA . 729 parts In-Stock

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$6.271

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$5.769

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729

$6.271

$5.769

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IDEA Electronic Components Group

UK . 676 parts In-Stock

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$6.399

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$5.759

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676

$6.399

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ChromeModa Solutions

Germany . 124 parts In-Stock

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$6.399

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$5.247

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124

$6.399

$5.247

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AZTECH Wire

Italy . 752 parts In-Stock

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$18.121

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Component Stockers USA

USA . 764 parts In-Stock

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$99.990

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 2,581 parts In-Stock

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Microchip USA

USA . 447 parts In-Stock

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Perfect Parts

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Overview

Enhance your electronic projects with the Texas Instruments TL084QDG4 operational amplifier. Crafted by a renowned manufacturer, this op amp offers exceptional quality, reliability, and performance. With versatile applications in various industries, this product provides value through its precision, low bias current, and high common mode rejection ratio. Elevate your designs with the TL084QDG4 and experience superior functionality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This package material provides durability and protection for the internal components of the operational amplifier, ensuring long-term reliability.

Maximum Input Offset Voltage: 15000 uV

The low input offset voltage ensures accurate signal processing and minimal distortion in the output signal.

Surface Mount: YES

Surface mount technology allows for easy and secure installation on circuit boards, saving space and improving overall system efficiency.

Nominal Unity Gain Bandwidth: 3000 kHz

The high unity gain bandwidth allows for a wide range of frequencies to be accurately amplified, making this operational amplifier suitable for various applications.

Minimum Slew Rate: 8 V/us

The high slew rate enables fast response to input signal changes, making this operational amplifier ideal for applications requiring rapid signal processing.

Technical Specifications

Operational Amplifiers (Op Amps) TL084QDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±15 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

3 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

86 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

15000 uV

Minimum Voltage Gain:

25000

Minimum Slew Rate:

8 V/us

Nominal Slew Rate:

13 V/us

Maximum Input Offset Current (IIO):

2 nA

Peak Bias Current:

50 nA

Maximum Bias Current (IIB) @25 °C:

200 pA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

11.2 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TL084QDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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