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TL074BCNSRE4

Texas Instruments

TL074BCNSRE4 by Texas Instruments

TL074BCNSRE4 by Texas Instruments is a quad operational amplifier with 4 functions, featuring a max input offset voltage of 5000 uV and min slew rate of 8 V/us. Ideal for applications requiring low-bias current amplification in commercial temperature grades, this op amp operates on +-15V supplies with a nominal unity gain bandwidth of 3000 kHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,372 parts In-Stock

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Digiode

USA . 4,171 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 215 parts In-Stock

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$5.410

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215

$5.410

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Parana Technologies

USA . 2,030 parts In-Stock

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$5.571

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$6.357

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$5.571

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$6.357

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DigiPath Technology Company

USA . 341 parts In-Stock

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$6.134

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$5.643

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341

$6.134

$5.643

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ChromeModa Solutions

Germany . 2,899 parts In-Stock

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$6.259

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$5.132

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2,899

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IDEA Electronic Components Group

UK . 923 parts In-Stock

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$6.259

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$5.633

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923

$6.259

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AZTECH Wire

Italy . 417 parts In-Stock

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$19.234

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$19.234

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Component Stockers USA

USA . 521 parts In-Stock

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$99.990

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Corphita

USA . 4,155 parts In-Stock

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Microchip USA

USA . 3,240 parts In-Stock

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Overview

Enhance your electronic designs with the TL074BCNSRE4 operational amplifier by Texas Instruments. With a reputation for manufacturing high-quality components, Texas Instruments delivers reliability and performance in every product. The TL074BCNSRE4 is perfect for a wide range of applications in audio equipment, instrumentation, and control systems. Experience the value this op amp brings with its precision, low bias current, and high common mode rejection ratio. Trust Texas Instruments to provide the innovation you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the operational amplifier, making it suitable for various applications.

Maximum Input Offset Voltage: 5000 uV

Low input offset voltage ensures accurate signal processing and improved performance.

Maximum Average Bias Current (IIB): 0.007 uA

Low bias current helps in minimizing power consumption and signal distortion.

Surface Mount: YES

Surface mount packaging allows for easy and secure PCB mounting, saving space and offering convenience in assembly.

Nominal Common Mode Reject Ratio: 100 dB

High common mode rejection ratio ensures effective suppression of common mode noise for cleaner output signals.

Minimum Slew Rate: 8 V/us

Fast slew rate enables the operational amplifier to respond quickly to input changes, making it suitable for high-speed applications.

Technology: BIPOLAR

Bipolar technology provides consistent performance and good stability over a wide range of operating conditions.

Nominal Unity Gain Bandwidth: 3000 kHz

High unity gain bandwidth allows for efficient signal amplification and processing across a wide frequency range.

Technical Specifications

Operational Amplifiers (Op Amps) TL074BCNSRE4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±15 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

3 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

100 dB

Input Offset Voltage Limit:

5000 uV

Minimum Voltage Gain:

25000

Minimum Slew Rate:

8 V/us

Nominal Slew Rate:

13 V/us

Maximum Input Offset Current (IIO):

2 nA

Peak Bias Current:

7 nA

Maximum Bias Current (IIB) @25 °C:

200 pA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-18 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Maximum Supply Current:

10 mA

Physical Characteristics

Length:

0.402 in (10.2 mm)

Width:

0.209 in (5.3 mm)

Maximum Seated Height:

0.079 in (2 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.3

Trade Compliance

TL074BCNSRE4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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