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TL062IDG4

Texas Instruments

TL062IDG4 by Texas Instruments

TL062IDG4 by Texas Instruments is a dual operational amplifier with 86dB CMRR and 1.5V/us slew rate. Ideal for industrial applications, it operates b/w -40 to 85°C with low bias current of 0.02uA, making it suitable for micropower designs requiring precise signal amplification in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,478 parts In-Stock

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Digiode

USA . 1,549 parts In-Stock

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1,549

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QIE Inc.

USA . 1,125 parts In-Stock

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Semtec, LLC

USA . 59 parts In-Stock

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59

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Parana Technologies

USA . 1,200 parts In-Stock

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$1.908

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$2.446

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$1.908

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$2.446

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DigiPath Technology Company

USA . 1,921 parts In-Stock

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$2.101

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$2.101

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IDEA Electronic Components Group

UK . 1,743 parts In-Stock

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$2.144

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$1.930

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1,743

$2.144

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$1.930

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ChromeModa Solutions

Germany . 12 parts In-Stock

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$2.144

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$1.758

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12

$2.144

$1.758

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Corohmni

South Africa . 179 parts In-Stock

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$2.606

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Advanced Electronics

New Zealand . 95 parts In-Stock

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$3.398

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$3.228

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$3.228

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$3.228

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Ampacity Inc.

Singapore . 181 parts In-Stock

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$3.410

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One Stop Electronics

USA . 1,193 parts In-Stock

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$4.410

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Semicontronic

India . 132 parts In-Stock

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$9.410

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$9.175

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$9.128

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132

$9.410

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$9.128

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AZTECH Wire

Italy . 330 parts In-Stock

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$13.663

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Argo Parts USA

USA . 4,494 parts In-Stock

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Corphita

USA . 3,710 parts In-Stock

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Continental Prestige Electronics

USA . 2,625 parts In-Stock

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Microchip USA

USA . 1,543 parts In-Stock

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Perfect Parts

USA . 1,428 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Elevate your electronic designs with the TL062IDG4 operational amplifier by Texas Instruments, a trusted manufacturer renowned for innovation and quality. Ideal for a wide range of applications, this op amp offers unmatched precision and performance. With low bias current and micropower capabilities, this compact yet powerful device delivers superior functionality while maintaining exceptional efficiency. Take your projects to the next level with the TL062IDG4 and experience unparalleled value and reliability that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the op amp, ensuring long-term reliability.

Maximum Input Offset Voltage: 9000 uV

Low input offset voltage helps in minimizing errors in signal processing applications, making this op amp suitable for precision tasks.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Nominal Common Mode Reject Ratio: 86 dB

High common mode rejection ratio indicates the op amp's ability to reject common mode signals, leading to cleaner and more accurate output signals.

Nominal Supply Voltage / Vsup (V): 15

Suitable supply voltage range ensures stable operation and optimal performance of the op amp in various applications.

Minimum Slew Rate: 1.5 V/us

Fast slew rate enables the op amp to respond quickly to input voltage changes, making it ideal for applications requiring rapid signal processing.

Technology: BIPOLAR

Bipolar technology offers low noise and high speed operation, making this op amp suitable for high-performance and precision applications.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this device is versatile and can be used in a wide range of analog circuit designs for amplification, filtering, and signal conditioning.

Technical Specifications

Operational Amplifiers (Op Amps) TL062IDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±15 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

86 dB

Minimum Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

9000 uV

Minimum Voltage Gain:

4000

Minimum Slew Rate:

1.5 V/us

Nominal Slew Rate:

3.5 V/us

Maximum Input Offset Current (IIO):

100 pA

Peak Bias Current:

20 nA

Maximum Bias Current (IIB) @25 °C:

200 pA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

500 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Screening Level:

MIL-PRF-38535

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TL062IDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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