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TL052AIDRG4

Texas Instruments

TL052AIDRG4 by Texas Instruments

TL052AIDRG4 by Texas Instruments is a dual operational amplifier with 4600uV max input offset voltage and 85dB nominal CMRR. Ideal for industrial applications, it operates at -40 to 85 °C, with low bias current of 0.0002uA and unity gain bandwidth of 3000 kHz.

Median Price

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3

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1k+

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Vyrian

USA . 7,348 parts In-Stock

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Digiode

USA . 1,764 parts In-Stock

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Nova Conductors

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Corohmni

South Africa . 802 parts In-Stock

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$0.757

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802

$0.757

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Parana Technologies

USA . 415 parts In-Stock

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$2.171

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$2.683

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415

$2.171

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$2.683

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DigiPath Technology Company

USA . 1,544 parts In-Stock

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$2.390

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$2.199

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$2.390

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ChromeModa Solutions

Germany . 4,914 parts In-Stock

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$2.439

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$2.000

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$2.439

$2.000

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IDEA Electronic Components Group

UK . 842 parts In-Stock

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$2.439

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$2.195

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842

$2.439

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Ampacity Inc.

Singapore . 1,038 parts In-Stock

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$5.410

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One Stop Electronics

USA . 1,527 parts In-Stock

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$8.410

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Semicontronic

India . 543 parts In-Stock

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$9.410

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$9.175

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$9.128

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AZTECH Wire

Italy . 782 parts In-Stock

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$11.993

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A-Z Elektronik GmbH

Germany . 7,275 parts In-Stock

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Corphita

USA . 4,346 parts In-Stock

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Argo Parts USA

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Microchip USA

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Continental Prestige Electronics

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Bastille Electronics

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Overview

Discover the power of the TL052AIDRG4 by Texas Instruments, a top-of-the-line operational amplifier designed to deliver exceptional performance and reliability in a variety of applications. With Texas Instruments' reputation for quality and innovation, this op amp offers unparalleled precision and efficiency, making it ideal for use in industrial settings where accuracy is paramount. Experience seamless operation and consistent results with the TL052AIDRG4, providing customers with unmatched value and peace of mind. Elevate your projects with this advanced amplifier from a trusted industry leader.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it suitable for various environments.

Maximum Input Offset Voltage: 4600 uV

Low input offset voltage ensures accurate and precise signal processing in the circuit.

Maximum Average Bias Current (IIB): 0.0002 uA

Minimal bias current results in lower power consumption and improved performance.

Surface Mount: YES

Surface mounting capability allows for easy and efficient integration onto circuit boards.

No. of Functions: 2

Having multiple functions in a single package saves space and simplifies circuit design.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy placement and soldering on PCBs.

Nominal Common Mode Reject Ratio: 85 dB

High common mode rejection ratio minimizes noise interference for accurate signal amplification.

Nominal Supply Voltage / Vsup (V): 5

5V supply voltage ensures compatibility with a wide range of applications.

Power Supplies (V): +-5/+-15

Allows flexibility in power supply options, catering to different voltage requirements.

No. of Terminals: 8

Sufficient terminals for connecting to external components and peripherals.

Maximum Input Offset Current (IIO): 0.01 uA

Low input offset current enhances accuracy and stability in signal processing.

Package Style (Meter): SMALL OUTLINE

Compact small outline package conserves space on the PCB.

Minimum Slew Rate: 8 V/us

Fast slew rate enables rapid response to input signals for dynamic applications.

Maximum Supply Voltage Limit: 18 V

High supply voltage limit offers versatility in power supply options.

Maximum Operating Temperature: 85 °C

Ability to operate at high temperatures ensures reliability in harsh environments.

Frequency Compensation: YES

Frequency compensation ensures stability and prevents oscillations in the circuit.

Minimum Voltage Gain: 20000

High voltage gain amplifies weak signals effectively for improved signal clarity.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold temperatures, suitable for industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Durable terminal finish ensures long-term reliability and connectivity.

Terminal Position: DUAL

Dual terminal position allows for flexibility in PCB layout and connection.

Maximum Seated Height: 1.75 mm

Low profile design saves space and enables compact product packaging.

Width: 3.9 mm

Slim width enhances versatility in PCB layout and component placement.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures robust soldering during assembly.

Length: 4.9 mm

Compact length facilitates compact design and efficient use of space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range makes it suitable for demanding applications.

Low-Bias: YES

Low bias current minimizes power consumption and ensures stable operation.

Maximum Negative Supply Voltage Limit: -18 V

Ability to handle negative supply voltages enables versatile power supply configurations.

Nominal Unity Gain Bandwidth: 3000 kHz

High unity gain bandwidth allows for broad frequency response and accurate signal reproduction.

Minimum Common Mode Reject Ratio: 75 dB

Adequate common mode rejection ratio reduces noise interference for clean signal amplification.

Technology: BIPOLAR

Bipolar technology provides reliable performance and precise signal processing capabilities.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and secure PCB mounting.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier design ensures accurate and stable signal amplification for various applications.

Maximum Supply Current: 6.4 mA

Efficient power consumption with a maximum supply current of 6.4 mA.

Nominal Negative Supply Voltage (Vsup): -5 V

Negative supply voltage of -5V allows for bi-polar power supply configurations.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture provides precise and stable amplification of input signals.

Packing Method: TR

Tape and reel packing method facilitates automated assembly processes.

Nominal Slow Rate: 17.8 V/us

High slew rate ensures fast response time for dynamic signal processing applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy interfacing and connectivity within the circuit.

Technical Specifications

Operational Amplifiers (Op Amps) TL052AIDRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±5/±15 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

3 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Minimum Common Mode Rejection Ratio (CMRR ):

75 dB

Input Offset Voltage Limit:

4600 uV

Minimum Voltage Gain:

20000

Minimum Slew Rate:

8 V/us

Nominal Slew Rate:

17.8 V/us

Maximum Input Offset Current (IIO):

10 nA

Peak Bias Current:

200 pA

Maximum Bias Current (IIB) @25 °C:

200 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

6.4 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TL052AIDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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