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THS8133ACPHP

Texas Instruments

THS8133ACPHP by Texas Instruments

THS8133ACPHP by Texas Instruments is a 10-bit D/A converter with max analog output voltage of 2.4V, settling time of 0.009us, and linearity error of 0.1172%. Ideal for applications requiring precise analog signal generation in commercial temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,109 parts In-Stock

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4,109

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Vyrian

USA . 3,099 parts In-Stock

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3,099

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 246 parts In-Stock

1+ parts

$12.190

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246

$12.190

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One Stop Electronics

USA . 1,613 parts In-Stock

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$13.000

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1,613

$13.000

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Parana Technologies

USA . 1,921 parts In-Stock

1+ parts

$23.122

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$23.758

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1,921

$23.122

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$23.758

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DigiPath Technology Company

USA . 2,306 parts In-Stock

1+ parts

$25.460

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2,306

$25.460

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ChromeModa Solutions

Germany . 2,548 parts In-Stock

1+ parts

$25.980

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$21.304

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2,548

$25.980

$21.304

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IDEA Electronic Components Group

UK . 374 parts In-Stock

1+ parts

$25.980

100+ parts

$24.681

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$23.382

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374

$25.980

$24.681

$23.382

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Corphita

USA . 3,601 parts In-Stock

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Overview

Enhance your electronic designs with the THS8133ACPHP digital-to-analog converter by Texas Instruments. Known for their top-quality products, Texas Instruments delivers reliable solutions for a wide range of applications. With a maximum analog output voltage of 2.4V and fast settling time of 0.009us, this converter offers precision and efficiency. The compact design and low power consumption make it a valuable addition to any project. Upgrade your devices with the THS8133ACPHP and experience superior performance like never before.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.4 V

Provides a high maximum analog output voltage, allowing for a wide range of output signals.

No. of Bits: 10

With a higher number of bits, this digital-to-analog converter offers higher resolution and accuracy in converting digital signals to analog.

Maximum Settling Time: 0.009 us

Fast settling time ensures quick response and accurate output signals.

Power Supplies (V): 3.3/5.5

Compatibility with different power supply voltages provides flexibility in system integration.

Nominal Settling Time (tstl): 0.005 us

Nominal settling time ensures stable and reliable output signals in a short period.

Maximum Supply Current: 142 mA

Efficient power consumption of the device helps in reducing overall system power requirements.

Technical Specifications

Digital-to-Analog Converters THS8133ACPHP attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.1172 %

Nominal Settling Time (tstl):

5 ns

Maximum Supply Current:

142 mA

Maximum Settling Time:

9 ns

No. of Bits:

10

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Maximum Analog Output Voltage:

2.4 V

Power Supplies:

3.3/5,5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

No. of Terminals:

48

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQFP-G48

Trade Compliance

THS8133ACPHP Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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