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THS4631DGNRG4

Texas Instruments

THS4631DGNRG4 by Texas Instruments

THS4631DGNRG4 by Texas Instruments is an Operational Amplifier with 2000uV Max Input Offset Voltage, 95dB Nominal CMRR, and 25MHz Nominal Bandwidth. Ideal for industrial applications requiring low-bias current amplification in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Chip Stock

USA . 4,587 parts In-Stock

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Vyrian

USA . 4,173 parts In-Stock

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Digiode

USA . 2,932 parts In-Stock

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Nova Conductors

Japan . 33 parts In-Stock

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North Shore Components

USA . 4 parts In-Stock

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Ampacity Inc.

Singapore . 843 parts In-Stock

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$2.410

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$2.410

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Corohmni

South Africa . 240 parts In-Stock

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$3.361

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Parana Technologies

USA . 1,601 parts In-Stock

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$5.004

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$464.741

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$4.504

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$5.004

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DigiPath Technology Company

USA . 1,413 parts In-Stock

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$5.511

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$5.070

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ChromeModa Solutions

Germany . 5,378 parts In-Stock

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$5.623

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$4.611

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IDEA Electronic Components Group

UK . 1,089 parts In-Stock

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$5.061

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Semicontronic

India . 1,182 parts In-Stock

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$8.200

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$8.158

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One Stop Electronics

USA . 136 parts In-Stock

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AZTECH Wire

Italy . 722 parts In-Stock

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Continental Prestige Electronics

USA . 5,486 parts In-Stock

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Argo Parts USA

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Corphita

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Microchip USA

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Bastille Electronics

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Advanced Electronics

New Zealand . 28 parts In-Stock

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Overview

Experience superior performance and reliability with the THS4631DGNRG4 operational amplifier from Texas Instruments. Designed with precision and quality in mind, this amplifier is perfect for a wide range of applications in industries such as automotive, industrial, and communications. Enjoy the benefits of its low-bias current, wide bandwidth, and high voltage gain, providing unmatched value and efficiency to customers. Trust Texas Instruments for top-notch products that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for electronic components.

Maximum Input Offset Voltage: 2000 uV

Low input offset voltage ensures accurate signal processing.

Maximum Average Bias Current (IIB): 0.002 uA

Low bias current reduces signal distortion and improves overall performance.

Surface Mount: YES

Ease of installation and space-saving design.

Nominal Common Mode Reject Ratio: 95 dB

High CMRR minimizes interference and ensures accurate signal amplification.

Nominal Supply Voltage / Vsup (V): 15

Optimal supply voltage for efficient operation.

Power Supplies (V): +-5/+-15

Versatile power supply options for different applications.

Maximum Input Offset Current (IIO): 0.0001 uA

Negligible input offset current for accurate signal processing.

Maximum Supply Voltage Limit: 16.5 V

Safety feature to protect the component from high voltage inputs.

Frequency Compensation: YES

Stable performance over a wide range of frequencies.

Nominal Unity Gain Bandwidth: 210000 kHz

High unity gain bandwidth for fast and accurate signal processing.

Technical Specifications

Operational Amplifiers (Op Amps) THS4631DGNRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Power Supply:

±5/±15 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Bandwidth (3dB):

25 MHz

Nominal Unity Gain Bandwidth:

210 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

95 dB

Minimum Common Mode Rejection Ratio (CMRR ):

86 dB

Input Offset Voltage Limit:

2000 uV

Minimum Voltage Gain:

1780

Nominal Slew Rate:

1000 V/us

Maximum Input Offset Current (IIO):

100 pA

Peak Bias Current:

2 nA

Maximum Bias Current (IIB) @25 °C:

100 pA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

16.5 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-16.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

13 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.042 in (1.07 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold Silver

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

THS4631DGNRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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