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THS4601CDDARG3

Texas Instruments

THS4601CDDARG3 by Texas Instruments

THS4601CDDARG3 by Texas Instruments is an Operational Amplifier with 8 terminals in a small outline package. It features a low profile design, Gull Wing terminal form, and is surface mountable. Ideal for commercial applications requiring precise signal amplification in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,449 parts In-Stock

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9,449

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Digiode

USA . 2,323 parts In-Stock

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2,323

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Distributors (Availability)

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Corohmni

South Africa . 411 parts In-Stock

1+ parts

$1.763

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411

$1.763

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Ampacity Inc.

Singapore . 875 parts In-Stock

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$2.410

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875

$2.410

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Parana Technologies

USA . 1,756 parts In-Stock

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$6.380

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$7.130

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1,756

$6.380

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$7.130

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One Stop Electronics

USA . 996 parts In-Stock

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$6.410

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996

$6.410

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DigiPath Technology Company

USA . 652 parts In-Stock

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$7.026

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$6.464

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652

$7.026

$6.464

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ChromeModa Solutions

Germany . 2,485 parts In-Stock

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$7.169

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$5.879

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2,485

$7.169

$5.879

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IDEA Electronic Components Group

UK . 607 parts In-Stock

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$7.169

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$6.452

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607

$7.169

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$6.452

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AZTECH Wire

Italy . 290 parts In-Stock

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$18.040

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290

$18.040

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Continental Prestige Electronics

USA . 5,747 parts In-Stock

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Microchip USA

USA . 4,708 parts In-Stock

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Argo Parts USA

USA . 2,434 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Corphita

USA . 547 parts In-Stock

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547

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Overview

Looking for top-quality operational amplifiers that deliver exceptional performance? Look no further than the THS4601CDDARG3 by Texas Instruments. Known for their reliability and precision, Texas Instruments products are trusted by professionals worldwide. These operational amplifiers are perfect for a wide range of applications, providing unmatched value and benefits to customers. Upgrade your projects with the THS4601CDDARG3 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good insulation properties and can provide protection against environmental factors, making the op amp durable and reliable.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options and allows for more functionality in the circuit design.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

The small outline, heat sink/slug, and low profile package style enables efficient heat dissipation and ensures a compact design for space-constrained applications.

Maximum Seated Height: 1.68 mm

Low maximum seated height allows for a slim profile, making it suitable for compact electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation within standard operating conditions, suitable for a wide range of applications.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile and commonly used in signal processing and amplification applications, making this product suitable for various electronic circuits.

Terminal Pitch: 1.27 mm

Having a terminal pitch of 1.27 mm facilitates easy connection and integration into PCB layouts, enabling efficient circuit design and assembly.

Technical Specifications

Operational Amplifiers (Op Amps) THS4601CDDARG3 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.193 in (4.89 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.066 in (1.68 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Low Profile

Trade Compliance

THS4601CDDARG3 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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