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THS4500MDGNREP

Texas Instruments

THS4500MDGNREP by Texas Instruments

THS4500MDGNREP by Texas Instruments is an Operational Amplifier with a 30 MHz bandwidth, 370000 kHz unity gain bandwidth, and 80 dB common mode reject ratio. Ideal for military applications due to its MILITARY temperature grade, it operates at -55 to 125 °C and has a compact square package with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,737 parts In-Stock

1+ parts

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9,737

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Digiode

USA . 959 parts In-Stock

1+ parts

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959

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 186 parts In-Stock

1+ parts

$2.512

100+ parts

-

1k+ parts

$3.001

10k+ parts

-

186

$2.512

-

$3.001

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ChromeModa Solutions

Germany . 6,034 parts In-Stock

1+ parts

$2.823

100+ parts

$2.315

1k+ parts

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6,034

$2.823

$2.315

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IDEA Electronic Components Group

UK . 1,099 parts In-Stock

1+ parts

$2.823

100+ parts

-

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$2.541

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1,099

$2.823

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$2.541

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One Stop Electronics

USA . 717 parts In-Stock

1+ parts

$3.410

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717

$3.410

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AZTECH Wire

Italy . 318 parts In-Stock

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$14.769

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318

$14.769

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Microchip USA

USA . 1,582 parts In-Stock

1+ parts

$32.000

100+ parts

$31.540

1k+ parts

$31.310

10k+ parts

$31.090

1,582

$32.000

$31.540

$31.310

$31.090

Corphita

USA . 4,319 parts In-Stock

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4,319

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DigiPath Technology Company

USA . 1,519 parts In-Stock

1+ parts

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$2.545

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1,519

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$2.545

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Overview

Discover the unparalleled performance and reliability of the THS4500MDGNREP by Texas Instruments, a leading manufacturer in the industry. Designed for precision and efficiency, this operational amplifier is ideal for a wide range of applications. With its high-quality construction and advanced features, this product delivers exceptional value and benefits to customers. Experience superior functionality and unmatched versatility with the THS4500MDGNREP, setting new standards in operational amplifiers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the operational amplifier.

Maximum Input Offset Voltage: 7000 uV

Low input offset voltage allows for accurate signal processing and minimal error in amplification.

Surface Mount: YES

Easily mountable on PCBs for efficient circuit assembly.

Nominal Common Mode Reject Ratio: 80 dB

High level of rejection of common-mode signals for cleaner output signals.

Nominal Supply Voltage / Vsup (V): 15

Suitable supply voltage for various applications requiring operational amplifiers.

Nominal Unity Gain Bandwidth: 370000 kHz

High bandwidth allows for amplification of signals up to this frequency range.

Amplifier Type: OPERATIONAL AMPLIFIER

Designed specifically for amplifying signals with high precision and efficiency.

Technical Specifications

Operational Amplifiers (Op Amps) THS4500MDGNREP attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Bandwidth (3dB):

30 MHz

Nominal Unity Gain Bandwidth:

370 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Minimum Common Mode Rejection Ratio (CMRR ):

74 dB

Input Offset Voltage Limit:

7000 uV

Minimum Voltage Gain:

282

Nominal Slew Rate:

2800 V/us

Maximum Input Offset Current (IIO):

2 uA

Peak Bias Current:

4.6 uA

Maximum Bias Current (IIB) @25 °C:

4.6 uA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

8.25 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-8.25 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

28 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

Trade Compliance

THS4500MDGNREP Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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