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THS4500IDRG4

Texas Instruments

THS4500IDRG4 by Texas Instruments

THS4500IDRG4 by Texas Instruments is an Operational Amplifier with 1000uV Max Input Offset Voltage, 80dB Nominal CMRR, and 300000 kHz Unity Gain Bandwidth. Widely used in industrial applications for precision signal amplification due to its low offset voltage and high bandwidth capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,578 parts In-Stock

1+ parts

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4,578

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Vyrian

USA . 3,089 parts In-Stock

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3,089

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 722 parts In-Stock

1+ parts

$0.410

100+ parts

-

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722

$0.410

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Parana Technologies

USA . 1,224 parts In-Stock

1+ parts

$4.607

100+ parts

-

1k+ parts

$5.074

10k+ parts

-

1,224

$4.607

-

$5.074

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DigiPath Technology Company

USA . 1,323 parts In-Stock

1+ parts

$5.072

100+ parts

$4.667

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1,323

$5.072

$4.667

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IDEA Electronic Components Group

UK . 2,216 parts In-Stock

1+ parts

$5.176

100+ parts

-

1k+ parts

$4.658

10k+ parts

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2,216

$5.176

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$4.658

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ChromeModa Solutions

Germany . 2,206 parts In-Stock

1+ parts

$5.176

100+ parts

$4.244

1k+ parts

-

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2,206

$5.176

$4.244

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AZTECH Wire

Italy . 363 parts In-Stock

1+ parts

$7.026

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363

$7.026

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Component Stockers USA

USA . 593 parts In-Stock

1+ parts

$99.990

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593

$99.990

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Corphita

USA . 4,644 parts In-Stock

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4,644

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Microchip USA

USA . 353 parts In-Stock

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353

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Overview

Elevate your electronic designs with the THS4500IDRG4 by Texas Instruments, a top-tier manufacturer of Operational Amplifiers (Op Amps). This versatile component boasts high-quality performance, making it ideal for a wide range of applications. From precision measurement instruments to audio amplifiers, this compact rectangular package delivers exceptional value and reliability. Experience the benefits of its low input offset voltage, minimal supply current, and wide operating temperature range. Trust in Texas Instruments to provide cutting-edge solutions for your circuit design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and helps in preventing damage to the internal components.

Maximum Input Offset Voltage: 1000 uV

Low input offset voltage ensures high precision in signal processing and accuracy in the output.

Nominal Supply Voltage / Vsup (V): 5

Stable nominal supply voltage of 5V ensures consistent performance of the operational amplifier.

Nominal Unity Gain Bandwidth: 300000 kHz

High unity gain bandwidth indicates that the operational amplifier can handle high-frequency signals efficiently.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range of -40 to 85°C ensures reliable operation in varied environmental conditions.

Technical Specifications

Operational Amplifiers (Op Amps) THS4500IDRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Power Supply:

5/±5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

300 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

1000 uV

Nominal Slew Rate:

92 V/us

Peak Bias Current:

5.2 uA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

8.25 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-8.25 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Maximum Supply Current:

34 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

THS4500IDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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