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THS4500CDR

Texas Instruments

THS4500CDR by Texas Instruments

THS4500CDR by Texas Instruments is an Operational Amplifier with 80 dB CMRR, 300 kHz Unity Gain Bandwidth, and 32 mA Max Supply Current. Ideal for applications requiring precise signal amplification in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,040 parts In-Stock

1+ parts

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5,040

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Digiode

USA . 4,431 parts In-Stock

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4,431

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,539 parts In-Stock

1+ parts

$5.410

100+ parts

-

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1,539

$5.410

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Parana Technologies

USA . 463 parts In-Stock

1+ parts

$6.492

100+ parts

-

1k+ parts

$7.237

10k+ parts

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463

$6.492

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$7.237

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DigiPath Technology Company

USA . 1,346 parts In-Stock

1+ parts

$7.148

100+ parts

$6.576

1k+ parts

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1,346

$7.148

$6.576

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IDEA Electronic Components Group

UK . 2,163 parts In-Stock

1+ parts

$7.294

100+ parts

-

1k+ parts

$6.565

10k+ parts

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2,163

$7.294

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$6.565

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ChromeModa Solutions

Germany . 626 parts In-Stock

1+ parts

$7.294

100+ parts

$5.981

1k+ parts

-

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626

$7.294

$5.981

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AZTECH Wire

Italy . 258 parts In-Stock

1+ parts

$16.315

100+ parts

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258

$16.315

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Corphita

USA . 3,070 parts In-Stock

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3,070

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Microchip USA

USA . 364 parts In-Stock

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364

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Overview

Looking for a high-quality Operational Amplifier that delivers exceptional performance? Look no further than the THS4500CDR by Texas Instruments. With a nominal unity gain bandwidth of 300000 kHz and a maximum input offset voltage of 0 uV, this product is perfect for applications requiring precision and accuracy. Whether you're designing medical equipment, industrial machinery, or audio systems, the THS4500CDR offers unmatched reliability and efficiency. Trust Texas Instruments to provide you with the best solutions for your amplification needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material makes the product lightweight and durable, suitable for a variety of applications.

Maximum Input Offset Voltage: 0 uV

The extremely low maximum input offset voltage ensures high precision and accuracy in signal processing.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves valuable space on the PCB.

Nominal Common Mode Reject Ratio: 80 dB

The high common mode reject ratio of 80 dB helps in rejecting common-mode noise and interference, leading to cleaner output signals.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V makes this product compatible with a wide range of electronic systems and applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this op amp can perform reliably in various environmental conditions.

Nominal Unity Gain Bandwidth: 300000 kHz

The high unity gain bandwidth of 300000 kHz ensures fast and efficient signal processing, making this op amp suitable for high-frequency applications.

Technical Specifications

Operational Amplifiers (Op Amps) THS4500CDR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Power Supply:

5/±5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

300 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

0 uV

Nominal Slew Rate:

92 V/us

Peak Bias Current:

5 uA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

8.25 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-8.25 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Maximum Supply Current:

32 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

THS4500CDR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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