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THS4304DRG4

Texas Instruments

THS4304DRG4 by Texas Instruments

THS4304DRG4 by Texas Instruments is an Operational Amplifier with 5000uV Max Input Offset Voltage, 18uA Max Average Bias Current, and 92dB Nominal CMRR. Ideal for industrial applications requiring a compact design and high bandwidth performance in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,584 parts In-Stock

1+ parts

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3,584

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Digiode

USA . 891 parts In-Stock

1+ parts

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891

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,224 parts In-Stock

1+ parts

$4.657

100+ parts

$432.507

1k+ parts

$4.192

10k+ parts

-

1,224

$4.657

$432.507

$4.192

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DigiPath Technology Company

USA . 1,830 parts In-Stock

1+ parts

$5.128

100+ parts

-

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1,830

$5.128

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ChromeModa Solutions

Germany . 5,599 parts In-Stock

1+ parts

$5.233

100+ parts

$4.291

1k+ parts

-

10k+ parts

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5,599

$5.233

$4.291

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IDEA Electronic Components Group

UK . 53 parts In-Stock

1+ parts

$5.233

100+ parts

-

1k+ parts

$4.710

10k+ parts

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53

$5.233

-

$4.710

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One Stop Electronics

USA . 183 parts In-Stock

1+ parts

$8.410

100+ parts

-

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183

$8.410

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AZTECH Wire

Italy . 302 parts In-Stock

1+ parts

$19.255

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302

$19.255

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Corphita

USA . 310 parts In-Stock

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310

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Microchip USA

USA . 217 parts In-Stock

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217

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Overview

Enhance your electronic designs with the THS4304DRG4 operational amplifier from Texas Instruments. Known for their high-quality components, Texas Instruments delivers reliable and efficient products that meet the demands of various applications. The THS4304DRG4 offers exceptional performance, low bias current, and a wide supply voltage range, making it ideal for industrial-grade projects. Experience superior signal processing and enhanced circuit functionality with this versatile component. Upgrade your designs today with the THS4304DRG4 by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for ease of handling and protection of internal components.

Maximum Input Offset Voltage: 5000 uV

Low offset voltage ensures accurate and precise signal processing.

Nominal Common Mode Reject Ratio: 92 dB

High common mode rejection ratio reduces noise interference for clean output signals.

Nominal Supply Voltage / Vsup (V): 3

Low supply voltage requirement for energy-efficient operation.

Frequency Compensation: YES

Provides stable performance over a wide range of frequencies.

Technology: BIPOLAR

Bipolar technology offers good precision and low noise for quality amplification.

Amplifier Type: OPERATIONAL AMPLIFIER

Designed specifically for amplifying and processing signals accurately.

Technical Specifications

Operational Amplifiers (Op Amps) THS4304DRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±1.35/±2.5/2.7/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

830 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

92 dB

Input Offset Voltage Limit:

5000 uV

Nominal Slew Rate:

750 V/us

Peak Bias Current:

18 uA

Maximum Bias Current (IIB) @25 °C:

12 uA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Maximum Supply Current:

19.4 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

THS4304DRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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