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THS4271MDGNREP

Texas Instruments

THS4271MDGNREP by Texas Instruments

THS4271MDGNREP by Texas Instruments is an Operational Amplifier with 14000uV Max Input Offset Voltage, 18uA Max Average Bias Current, and 72dB Nominal CMRR. Widely used in military applications due to its -55 to 125 °C operating temperature range and VOLTAGE-FEEDBACK architecture.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,154 parts In-Stock

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5,154

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Digiode

USA . 3,855 parts In-Stock

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3,855

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Distributors (Availability)

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Parana Technologies

USA . 751 parts In-Stock

1+ parts

$1.805

100+ parts

-

1k+ parts

$2.361

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751

$1.805

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$2.361

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DigiPath Technology Company

USA . 1,077 parts In-Stock

1+ parts

$1.987

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1,077

$1.987

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ChromeModa Solutions

Germany . 2,700 parts In-Stock

1+ parts

$2.028

100+ parts

$1.663

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2,700

$2.028

$1.663

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IDEA Electronic Components Group

UK . 2,177 parts In-Stock

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$2.028

100+ parts

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$1.825

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2,177

$2.028

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$1.825

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One Stop Electronics

USA . 300 parts In-Stock

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$7.410

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300

$7.410

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AZTECH Wire

Italy . 277 parts In-Stock

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$8.624

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277

$8.624

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Microchip USA

USA . 4,635 parts In-Stock

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$25.666

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4,635

$25.666

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Perfect Parts

USA . 4,249 parts In-Stock

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Corphita

USA . 616 parts In-Stock

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616

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Overview

Elevate your electronic designs with the THS4271MDGNREP by Texas Instruments, a top-tier operational amplifier that delivers unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this op amp is perfect for a wide range of applications, from audio equipment to industrial automation. With high-quality construction and advanced features, the THS4271MDGNREP ensures precision and efficiency in every project. Upgrade your designs today with the trusted brand and cutting-edge technology of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the package body, making the product suitable for various operating conditions.

Maximum Input Offset Voltage: 14000 uV

With a high maximum input offset voltage, this operational amplifier offers accurate and stable performance in voltage offset applications.

Maximum Average Bias Current (IIB): 18 uA

The low maximum average bias current ensures minimal power consumption and helps in maintaining efficiency in the circuit.

Surface Mount: YES

The surface mount capability of this op amp makes it easy to integrate into compact circuit designs, saving space and facilitating easy PCB assembly.

Nominal Common Mode Reject Ratio: 72 dB

With a high common mode reject ratio, this op amp can effectively suppress common-mode noise, leading to better signal fidelity and accuracy.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V makes this operational amplifier suitable for a wide range of applications and power supply configurations.

No. of Terminals: 8

The availability of 8 terminals provides flexibility in the circuit connections and allows for versatile usage in different circuit configurations.

Maximum Input Offset Current (IIO): 8 uA

The low maximum input offset current contributes to improved precision and accuracy in voltage sensing and measurement applications.

Maximum Supply Voltage Limit: 8.25 V

The high maximum supply voltage limit offers robustness and tolerance to voltage fluctuations, ensuring the longevity and stability of the op amp.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this op amp can withstand elevated temperatures, making it suitable for use in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

The wide temperature range from -55°C to 125°C enables the operational amplifier to function reliably in both extreme cold and hot temperature environments.

Nominal Unity Gain Bandwidth: 1400000 kHz

The high nominal unity gain bandwidth indicates the op amp's ability to handle high-frequency signals accurately, making it ideal for applications requiring fast response times.

Technical Specifications

Operational Amplifiers (Op Amps) THS4271MDGNREP attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Bandwidth (3dB):

40 MHz

Nominal Unity Gain Bandwidth:

1400 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

72 dB

Minimum Common Mode Rejection Ratio (CMRR ):

67 dB

Input Offset Voltage Limit:

14000 uV

Minimum Voltage Gain:

1412.5

Nominal Slew Rate:

1000 V/us

Maximum Input Offset Current (IIO):

8 uA

Peak Bias Current:

18 uA

Maximum Bias Current (IIB) @25 °C:

15 uA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

8.25 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-8.25 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

24 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.042 in (1.07 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold Silver

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

Trade Compliance

THS4271MDGNREP Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

NSN

5962-01-641-2135, 5962016412135

NIIN

016412135

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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