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THS4226DGQR

Texas Instruments

THS4226DGQR by Texas Instruments

THS4226DGQR by Texas Instruments is a dual operational amplifier with 10 terminals in a small outline package. It features a max seated height of 1.1mm, 0.5mm terminal pitch, and industrial temperature grade. Ideal for applications requiring precise signal amplification in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,827 parts In-Stock

1+ parts

-

100+ parts

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9,827

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Digiode

USA . 3,501 parts In-Stock

1+ parts

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3,501

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,386 parts In-Stock

1+ parts

$1.977

100+ parts

-

1k+ parts

$2.507

10k+ parts

-

1,386

$1.977

-

$2.507

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DigiPath Technology Company

USA . 115 parts In-Stock

1+ parts

$2.177

100+ parts

-

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115

$2.177

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ChromeModa Solutions

Germany . 2,811 parts In-Stock

1+ parts

$2.221

100+ parts

$1.821

1k+ parts

-

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2,811

$2.221

$1.821

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IDEA Electronic Components Group

UK . 659 parts In-Stock

1+ parts

$2.221

100+ parts

-

1k+ parts

$1.999

10k+ parts

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659

$2.221

-

$1.999

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One Stop Electronics

USA . 1,383 parts In-Stock

1+ parts

$9.410

100+ parts

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1,383

$9.410

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AZTECH Wire

Italy . 222 parts In-Stock

1+ parts

$10.920

100+ parts

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222

$10.920

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QUARKTWIN TECHNOLOGY LTD

USA . 16,078 parts In-Stock

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16,078

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A-Z Elektronik GmbH

Germany . 12,438 parts In-Stock

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12,438

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Microchip USA

USA . 5,714 parts In-Stock

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5,714

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Corphita

USA . 1,909 parts In-Stock

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1,909

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Overview

Experience unparalleled performance and reliability with the THS4226DGQR operational amplifiers by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and innovation in every product. Ideal for a wide range of applications, these op amps offer exceptional value and benefits to customers seeking superior performance and precision. Trust Texas Instruments for your operational amplifier needs and elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for industrial applications.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs.

No. of Functions: 2

Provides dual functionality in a single package, saving space and cost.

Package Shape: SQUARE

Compact shape that is easy to integrate into circuit designs.

No. of Terminals: 10

Sufficient number of terminals for connectivity and functionality.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Various package styles offer flexibility in design and thermal management.

Terminal Position: DUAL

Dual terminal position for improved stability and performance.

Maximum Seated Height: 1.1 mm

Low profile design for space-constrained applications.

Width: 3 mm

Compact width for easy integration into circuit layouts.

Length: 3 mm

Compact length for efficient use of board space.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions.

Terminal Form: GULL WING

Gull wing terminal form for secure soldering and connectivity.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier type for precision signal processing and amplification.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting and connectivity.

Technical Specifications

Operational Amplifiers (Op Amps) THS4226DGQR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

2

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

10

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G10

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

Trade Compliance

THS4226DGQR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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