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THS4140IDG4

Texas Instruments

THS4140IDG4 by Texas Instruments

THS4140IDG4 by Texas Instruments is an Operational Amplifier with 8500uV Max Input Offset Voltage, 15uA Max Average Bias Current, and 84dB Nominal CMRR. Widely used in industrial applications for its 160MHz Bandwidth, VOLTAGE-FEEDBACK Architecture, and -40 to 85 °C Operating Temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,173 parts In-Stock

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7,173

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Digiode

USA . 604 parts In-Stock

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604

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,758 parts In-Stock

1+ parts

$2.083

100+ parts

-

1k+ parts

$2.601

10k+ parts

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1,758

$2.083

-

$2.601

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DigiPath Technology Company

USA . 421 parts In-Stock

1+ parts

$2.293

100+ parts

$2.110

1k+ parts

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421

$2.293

$2.110

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IDEA Electronic Components Group

UK . 1,790 parts In-Stock

1+ parts

$2.340

100+ parts

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$2.106

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1,790

$2.340

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$2.106

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ChromeModa Solutions

Germany . 1,568 parts In-Stock

1+ parts

$2.340

100+ parts

$1.919

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1,568

$2.340

$1.919

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One Stop Electronics

USA . 1,501 parts In-Stock

1+ parts

$8.410

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1,501

$8.410

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AZTECH Wire

Italy . 300 parts In-Stock

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$10.309

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300

$10.309

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Corphita

USA . 2,751 parts In-Stock

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Microchip USA

USA . 1,302 parts In-Stock

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Overview

Elevate your circuit design with the THS4140IDG4 by Texas Instruments, a top-of-the-line operational amplifier that guarantees unmatched quality and performance. Crafted by the industry leader in semiconductor manufacturing, this amplifier opens doors to endless possibilities in applications across various industries. Experience seamless integration, reliable operation, and exceptional precision with this cutting-edge product. Trust Texas Instruments to deliver excellence in every aspect of your project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, ideal for applications where weight and cost are important factors.

Maximum Input Offset Voltage: 8500 uV

The low maximum input offset voltage ensures accurate and precise performance of the operational amplifier.

Maximum Average Bias Current (IIB): 15 uA

The low bias current helps in minimizing power consumption and ensures stable operation of the amplifier.

Surface Mount: YES

The surface mount feature makes installation and assembly easier and more convenient, suitable for automated manufacturing processes.

Nominal Common Mode Reject Ratio: 84 dB

The high common mode reject ratio indicates the amplifier's ability to reject noise and interference, resulting in clean and accurate signal amplification.

Nominal Supply Voltage / Vsup (V): 5

The consistent nominal supply voltage of 5V makes the amplifier compatible with a wide range of applications and systems.

Power Supplies (V): 5/30/+-2.5/+-15

The flexible power supply options allow for versatile usage in different environments and power configurations.

No. of Terminals: 8

The 8-terminal configuration provides ample connectivity options for input, output, and power supply connections.

Maximum Input Offset Current (IIO): 1 uA

The low input offset current ensures minimal input errors and helps in achieving accurate signal processing.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and makes the amplifier suitable for compact designs.

Maximum Supply Voltage Limit: 16.5 V

The high supply voltage limit provides flexibility in the power supply options and allows for robust operation in demanding conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in challenging environments where temperature fluctuations are common.

Frequency Compensation: YES

The presence of frequency compensation ensures stability and prevents oscillations, making the amplifier suitable for high-frequency applications.

Minimum Voltage Gain: 1000

The high minimum voltage gain ensures signal amplification with minimal distortion and ensures accurate signal processing.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for usage in cold environments without compromising performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish ensures reliable connections and prevents corrosion, increasing the longevity of the amplifier.

Terminal Position: DUAL

The dual terminal position provides flexibility in the installation orientation and allows for easy integration into various circuit designs.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for compact designs and space-efficient assembly in tight spaces.

Width: 3.9 mm

The narrow width of 3.9mm enables the amplifier to fit into tight spaces and narrow PCB layouts, suitable for compact electronic devices.

Nominal Bandwidth (3dB): 160 MHz

The high nominal bandwidth of 160MHz allows for high-speed signal processing and maintains signal integrity in demanding applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering and assembly during manufacturing processes, contributing to the overall quality of the amplifier.

Length: 4.9 mm

The short length of 4.9mm saves space on the PCB and allows for compact and efficient circuit designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh industrial environments where temperature variations and challenging conditions are common.

Maximum Negative Supply Voltage Limit: -16.5 V

The high negative supply voltage limit allows for a wide range of power supply options and compatibility with different voltage configurations.

Nominal Unity Gain Bandwidth: 170000 kHz

The high nominal unity gain bandwidth ensures stable operation and accurate signal amplification across various frequency ranges.

Minimum Common Mode Reject Ratio: 75 dB

Although not the highest, the minimum common mode reject ratio of 75dB still indicates good noise rejection capabilities for clean signal processing.

Technology: BIPOLAR

The bipolar technology offers high gain and linearity, making the operational amplifier suitable for precise and accurate signal amplification.

Terminal Form: GULL WING

The gull-wing terminal form provides reliable solder joints and easy assembly, ensuring robust connections and stable performance.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this product is designed for high gain, high input impedance, and high accuracy, making it suitable for a wide range of signal processing applications.

Maximum Supply Current: 16 mA

The low maximum supply current ensures efficient power consumption and helps in reducing heat dissipation, ideal for energy-efficient designs.

Nominal Negative Supply Voltage (Vsup): -5 V

The consistent negative supply voltage of -5V allows for dual-rail power supply configurations and ensures proper biasing for optimal amplifier performance.

Architecture: VOLTAGE-FEEDBACK

The voltage-feedback architecture offers high linearity, low distortion, and excellent stability, making the amplifier suitable for precision signal processing applications.

Packing Method: TUBE

The tube packing method provides protection during transportation and storage, ensuring that the operational amplifier reaches the end user in optimal condition.

Nominal Slow Rate: 450 V/us

The high nominal slow rate allows for fast response times and accurate signal processing, making the amplifier suitable for dynamic signal amplification.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27mm provides compatibility with common PCB designs and facilitates easy soldering and assembly.

Wideband: YES

The wideband feature allows for high-frequency signal processing and maintains signal integrity in applications that require rapid and accurate response times.

Technical Specifications

Operational Amplifiers (Op Amps) THS4140IDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

5/30/±2.5/±15 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Bandwidth (3dB):

160 MHz

Nominal Unity Gain Bandwidth:

170 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

84 dB

Minimum Common Mode Rejection Ratio (CMRR ):

75 dB

Input Offset Voltage Limit:

8500 uV

Minimum Voltage Gain:

1000

Nominal Slew Rate:

450 V/us

Maximum Input Offset Current (IIO):

1 uA

Peak Bias Current:

15 uA

Maximum Bias Current (IIB) @25 °C:

15 uA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

16.5 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-16.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

16 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

THS4140IDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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