Loading...

THS4062CDG4

Texas Instruments

THS4062CDG4 by Texas Instruments

THS4062CDG4 by Texas Instruments is a dual operational amplifier with 180 MHz bandwidth, 5000 min voltage gain, and 400 V/us slew rate. Ideal for applications requiring high-speed signal processing in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,421 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,421

-

-

-

-

Digiode

USA . 1,847 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,847

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,018 parts In-Stock

1+ parts

$3.960

100+ parts

-

1k+ parts

$4.431

10k+ parts

-

1,018

$3.960

-

$4.431

-

ChromeModa Solutions

Germany . 3,176 parts In-Stock

1+ parts

$4.450

100+ parts

$3.649

1k+ parts

-

10k+ parts

-

3,176

$4.450

$3.649

-

-

IDEA Electronic Components Group

UK . 1,086 parts In-Stock

1+ parts

$4.450

100+ parts

-

1k+ parts

$4.005

10k+ parts

-

1,086

$4.450

-

$4.005

-

One Stop Electronics

USA . 799 parts In-Stock

1+ parts

$5.410

100+ parts

-

1k+ parts

-

10k+ parts

-

799

$5.410

-

-

-

AZTECH Wire

Italy . 740 parts In-Stock

1+ parts

$10.705

100+ parts

-

1k+ parts

-

10k+ parts

-

740

$10.705

-

-

-

Component Stockers USA

USA . 409 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

409

$99.990

-

-

-

Corphita

USA . 4,367 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,367

-

-

-

-

Microchip USA

USA . 2,903 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,903

-

-

-

-

DigiPath Technology Company

USA . 779 parts In-Stock

1+ parts

-

100+ parts

$4.012

1k+ parts

-

10k+ parts

-

779

-

$4.012

-

-

Overview

Enhance your electronic designs with the Texas Instruments THS4062CDG4 Operational Amplifier. Crafted with precision by a trusted manufacturer, this op amp offers high-quality performance and reliability. Ideal for a wide range of applications, this product provides exceptional value with its advanced features and benefits. Elevate your projects with the THS4062CDG4 and experience superior functionality, efficiency, and versatility like never before. Trust in Texas Instruments for top-notch solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the operational amplifier, making it suitable for various environmental conditions.

Maximum Input Offset Voltage: 8000 uV

The low maximum input offset voltage of 8000 uV ensures accurate and precise signal processing, making this operational amplifier ideal for high-precision applications.

Maximum Average Bias Current (IIB): 6 uA

The low maximum average bias current of 6 uA helps in minimizing power consumption and improves the overall efficiency of the operational amplifier.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying the manufacturing process.

Nominal Common Mode Reject Ratio: 110 dB

The high nominal common mode reject ratio of 110 dB ensures effective rejection of common-mode signals, leading to clearer and more accurate output signals.

Nominal Supply Voltage / Vsup (V): 15

The nominal supply voltage of 15V provides ample power for the operational amplifier to operate efficiently across a wide range of applications.

Nominal Bandwidth (3dB): 180 MHz

The high nominal bandwidth of 180 MHz allows for fast signal processing and high-frequency response, making this operational amplifier suitable for demanding applications.

Technical Specifications

Operational Amplifiers (Op Amps) THS4062CDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Bandwidth (3dB):

180 MHz

Nominal Unity Gain Bandwidth:

180 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

110 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

8000 uV

Minimum Voltage Gain:

5000

Minimum Slew Rate:

400 V/us

Nominal Slew Rate:

400 V/us

Maximum Input Offset Current (IIO):

250 nA

Peak Bias Current:

6 uA

Maximum Bias Current (IIB) @25 °C:

3 uA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

16.5 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-16.5 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

21 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

THS4062CDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20