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THS4061IDRG4

Texas Instruments

THS4061IDRG4 by Texas Instruments

THS4061IDRG4 by Texas Instruments is an Operational Amplifier with 8000uV Max Input Offset Voltage, 6uA Max Average Bias Current, and 110dB Nominal CMRR. Widely used in industrial applications for its 180MHz Bandwidth, VFB Architecture, and -40 to 85°C Operating Temp Range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,708 parts In-Stock

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Digiode

USA . 4,477 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,544 parts In-Stock

1+ parts

$0.582

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-

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$1.670

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1,544

$0.582

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$1.670

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DigiPath Technology Company

USA . 966 parts In-Stock

1+ parts

$0.641

100+ parts

$0.590

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966

$0.641

$0.590

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ChromeModa Solutions

Germany . 4,526 parts In-Stock

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$0.654

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$0.536

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$0.654

$0.536

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IDEA Electronic Components Group

UK . 537 parts In-Stock

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$0.654

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$0.589

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537

$0.654

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$0.589

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One Stop Electronics

USA . 642 parts In-Stock

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$1.410

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642

$1.410

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AZTECH Wire

Italy . 617 parts In-Stock

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$7.389

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QUARKTWIN TECHNOLOGY LTD

USA . 25,317 parts In-Stock

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Microchip USA

USA . 3,857 parts In-Stock

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Corphita

USA . 2,207 parts In-Stock

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Overview

Experience unmatched precision and reliability with the THS4061IDRG4 operational amplifier from Texas Instruments. Crafted with cutting-edge technology, this op amp offers a wide range of applications in various industries. Whether you're designing high-performance audio equipment or precision instrumentation, the THS4061IDRG4 delivers exceptional value with its high bandwidth, low power consumption, and industrial-grade temperature range. Trust Texas Instruments for top-of-the-line quality and elevate your projects with the THS4061IDRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, suitable for a variety of applications.

Maximum Input Offset Voltage: 8000 uV

Low input offset voltage ensures accurate signal processing and minimal errors in the output.

Maximum Average Bias Current (IIB): 6 uA

Low bias current ensures minimal power consumption and stability in operation.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs.

Nominal Common Mode Reject Ratio: 110 dB

High common mode rejection ratio ensures effective suppression of noise and interference in the signal.

Nominal Supply Voltage / Vsup (V): 15

Suitable supply voltage for the operational amplifier to operate efficiently and within safe limits.

No. of Terminals: 8

Sufficient number of terminals for connecting input and output signals, power supply, and other necessary connections.

Maximum Input Offset Current (IIO): 0.25 uA

Low input offset current contributes to accurate signal processing and minimizes errors in the output.

Minimum Slew Rate: 400 V/us

High slew rate enables the operational amplifier to respond quickly to changes in input signals, ensuring fast and stable operation.

Width: 3.9 mm

Compact width allows for space-saving installation in electronic devices and PCBs.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes the operational amplifier suitable for use in various environmental conditions.

Technology: BIPOLAR

Bipolar technology offers high precision and low noise performance, making it ideal for applications requiring accuracy.

Technical Specifications

Operational Amplifiers (Op Amps) THS4061IDRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Bandwidth (3dB):

180 MHz

Nominal Unity Gain Bandwidth:

180 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

110 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

8000 uV

Minimum Voltage Gain:

5000

Minimum Slew Rate:

400 V/us

Nominal Slew Rate:

500 V/us

Maximum Input Offset Current (IIO):

250 nA

Peak Bias Current:

6 uA

Maximum Bias Current (IIB) @25 °C:

3 uA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

16.5 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-16.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

10.5 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

THS4061IDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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