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THS3125IPWPR

Texas Instruments

THS3125IPWPR by Texas Instruments

THS3125IPWPR by Texas Instruments is a dual operational amplifier with 138 MHz bandwidth, 67 dB CMRR, and 2 uA bias current. Ideal for industrial applications requiring high-speed signal processing in compact designs due to its small outline package and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,117 parts In-Stock

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6,117

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Digiode

USA . 4,838 parts In-Stock

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4,838

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Chip Stock

USA . 555 parts In-Stock

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555

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Distributors (Availability)

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Parana Technologies

USA . 581 parts In-Stock

1+ parts

$3.330

100+ parts

-

1k+ parts

$3.854

10k+ parts

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581

$3.330

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$3.854

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DigiPath Technology Company

USA . 2,339 parts In-Stock

1+ parts

$3.667

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2,339

$3.667

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ChromeModa Solutions

Germany . 2,096 parts In-Stock

1+ parts

$3.742

100+ parts

$3.068

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2,096

$3.742

$3.068

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IDEA Electronic Components Group

UK . 1,973 parts In-Stock

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$3.742

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$3.368

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1,973

$3.742

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$3.368

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One Stop Electronics

USA . 902 parts In-Stock

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$6.410

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902

$6.410

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AZTECH Wire

Italy . 637 parts In-Stock

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$15.854

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637

$15.854

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Microchip USA

USA . 1,300 parts In-Stock

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$16.880

100+ parts

$16.640

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$16.520

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$16.400

1,300

$16.880

$16.640

$16.520

$16.400

Corphita

USA . 3,307 parts In-Stock

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Overview

Enhance your electronic designs with the THS3125IPWPR operational amplifier by Texas Instruments. Crafted with precision and expertise, this high-quality component offers unrivaled performance in a variety of applications. Whether you're working on audio equipment, signal conditioning, or sensor interfaces, this op amp delivers superior functionality and reliability. Elevate your projects with the value and benefits that Texas Instruments brings to the table, and experience the advantages of using the THS3125IPWPR for your next innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for various applications.

Maximum Input Offset Voltage: 10000 uV

Low input offset voltage ensures accuracy in signal processing and minimal errors in the output.

Maximum Average Bias Current (IIB): 2 uA

Low bias current reduces power consumption and ensures stability in the amplifier performance.

Nominal Common Mode Reject Ratio: 67 dB

High common mode rejection ratio ensures that common noise signals are attenuated, leading to a cleaner output signal.

Nominal Supply Voltage / Vsup (V): 15

Stable supply voltage ensures consistent performance of the operational amplifier.

Nominal Bandwidth (3dB): 138 MHz

High bandwidth allows the operational amplifier to process a wide range of frequencies accurately.

Maximum Operating Temperature: 85 °C

Wide temperature range makes this operational amplifier suitable for industrial applications.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this product is versatile and can be used in various applications such as signal conditioning, filtering, and amplification.

Technical Specifications

Operational Amplifiers (Op Amps) THS3125IPWPR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Current Feedback

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Bandwidth (3dB):

138 MHz

Nominal Unity Gain Bandwidth:

138 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

67 dB

Minimum Common Mode Rejection Ratio (CMRR ):

63 dB

Input Offset Voltage Limit:

10000 uV

Nominal Slew Rate:

1550 V/us

Maximum Input Offset Current (IIO):

22 uA

Peak Bias Current:

2 uA

Maximum Bias Current (IIB) @25 °C:

2 uA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

16.5 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-16.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

9 mA

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

14

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

Trade Compliance

THS3125IPWPR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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