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THS3121IDGNG4

Texas Instruments

THS3121IDGNG4 by Texas Instruments

THS3121IDGNG4 by Texas Instruments is an operational amplifier with 13000uV max input offset voltage, 58dB common mode reject ratio, and 66MHz bandwidth. Ideal for industrial applications requiring high-speed signal processing in a compact package.

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1k+

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Vyrian

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Digiode

USA . 4,544 parts In-Stock

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Ampacity Inc.

Singapore . 1,263 parts In-Stock

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$1.410

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One Stop Electronics

USA . 1,224 parts In-Stock

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$2.410

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Parana Technologies

USA . 988 parts In-Stock

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$5.368

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$6.044

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988

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ChromeModa Solutions

Germany . 2,914 parts In-Stock

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$6.032

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$4.946

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$4.946

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IDEA Electronic Components Group

UK . 1,984 parts In-Stock

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$6.032

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$5.429

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AZTECH Wire

Italy . 714 parts In-Stock

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$13.940

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Component Stockers USA

USA . 382 parts In-Stock

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$99.990

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Corphita

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DigiPath Technology Company

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Microchip USA

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Overview

Unleash the power of precision with the Texas Instruments THS3121IDGNG4 operational amplifier. Crafted with expertise by a renowned manufacturer, this high-quality component is designed to deliver exceptional performance in a wide range of applications. Offering unparalleled reliability and efficiency, this amplifier provides customers with the value and benefits they need to elevate their projects to new heights. Experience seamless operation, superior functionality, and unmatched results with the THS3121IDGNG4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides good protection for the operational amplifier inside, ensuring reliable performance and durability.

Maximum Input Offset Voltage: 13000 uV

The low maximum input offset voltage helps in minimizing errors and inaccuracies in signal processing, making this operational amplifier suitable for precision applications.

Maximum Average Bias Current (IIB): 4 uA

With a low maximum average bias current, this operational amplifier consumes less power and generates less heat, contributing to overall energy efficiency.

Surface Mount: YES

Being surface mountable makes it easy to integrate this operational amplifier onto PCBs, saving space and facilitating automated assembly processes.

Nominal Common Mode Reject Ratio: 58 dB

The decent nominal common mode reject ratio helps in reducing interference and noise in the signal path, enhancing signal clarity and integrity.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this operational amplifier compatible with many standard power sources and easy to integrate into existing circuits.

No. of Terminals: 8

The 8 terminals provide sufficient connectivity options for input, output, power, and control signals, offering versatility in circuit design.

Maximum Input Offset Current (IIO): 15 uA

The low maximum input offset current helps in minimizing errors due to input offset, ensuring accurate signal processing and output.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch of the package style make this operational amplifier suitable for compact and space-constrained applications.

Maximum Supply Voltage Limit: 16.5 V

Having a high maximum supply voltage limit provides flexibility in power source selection, making this operational amplifier compatible with a wide range of voltage levels.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this operational amplifier to withstand elevated temperature environments, expanding its range of applications.

Frequency Compensation: YES

Frequency compensation ensures stability and reliable performance of the operational amplifier across varying frequencies, making it suitable for dynamic signal processing.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this operational amplifier to function reliably in cold environments, increasing its versatility in diverse operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The high-quality terminal finish enhances the conductivity and durability of the terminals, contributing to the overall performance and longevity of the operational amplifier.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in circuit layout and connection options, enabling diverse configurations and designs.

Maximum Seated Height: 1.1 mm

The low maximum seated height allows for a slim and compact form factor, suitable for applications where space constraints are critical.

Width: 3 mm

The narrow width of 3mm makes this operational amplifier suitable for compact PCB designs and applications where space optimization is essential.

Nominal Bandwidth (3dB): 66 MHz

With a wide nominal bandwidth of 66 MHz, this operational amplifier can handle high-frequency signals with accuracy and precision, making it ideal for fast signal processing.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature ensures proper soldering and assembly of the operational amplifier, leading to reliable connections and performance.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this operational amplifier can withstand the soldering process without compromising its integrity, ensuring durable and robust connections.

Length: 3 mm

The compact length of 3mm contributes to the overall small form factor of this operational amplifier, making it suitable for applications with limited space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that this operational amplifier can operate reliably in harsh industrial environments, offering durability and resilience to challenging conditions.

Maximum Negative Supply Voltage Limit: -16.5 V

Having a high maximum negative supply voltage limit enables flexibility in powering options, allowing this operational amplifier to work with various power supply configurations.

Nominal Unity Gain Bandwidth: 85000 kHz

The high nominal unity gain bandwidth of 85000 kHz indicates the operational amplifier's ability to process signals accurately and quickly, making it suitable for high-speed applications.

Minimum Common Mode Reject Ratio: 63 dB

The high minimum common mode reject ratio helps in rejecting common-mode noise and interference, ensuring clean and clear signal output even in challenging environments.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy and secure soldering onto PCBs, ensuring reliable connections and efficient assembly processes.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this product is specifically designed for precise amplification and processing of signals, making it a suitable choice for various signal conditioning applications.

Maximum Supply Current: 4.25 mA

The low maximum supply current consumption of 4.25 mA reduces power demand and heat generation, contributing to energy efficiency and prolonged operational lifespan.

Nominal Negative Supply Voltage (Vsup): -5 V

Operating at a nominal negative supply voltage of -5V allows this operational amplifier to handle bipolar power configurations, increasing its compatibility with diverse electronic systems.

Architecture: CURRENT-FEEDBACK

The current-feedback architecture enhances the operational amplifier's speed and stability, making it suitable for high-speed and high-frequency signal processing applications.

Packing Method: TUBE

The tube packing method provides secure storage and transportation of the operational amplifier, ensuring protection from damage and contamination during handling and shipping.

Nominal Slow Rate: 620 V/us

The high nominal slow rate of 620 V/us ensures rapid signal response and amplification, making this operational amplifier suitable for applications requiring fast signal processing.

Terminal Pitch: 0.65 mm

The narrow terminal pitch of 0.65mm allows for dense and compact PCB layouts, enabling space-efficient designs and layouts in electronic circuits.

Wideband: YES

The wideband capability of this operational amplifier allows it to handle a broad range of frequencies with accuracy and precision, making it suitable for versatile signal processing applications.

Technical Specifications

Operational Amplifiers (Op Amps) THS3121IDGNG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Current Feedback

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Bandwidth (3dB):

66 MHz

Nominal Unity Gain Bandwidth:

85 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

58 dB

Minimum Common Mode Rejection Ratio (CMRR ):

63 dB

Input Offset Voltage Limit:

13000 uV

Nominal Slew Rate:

620 V/us

Maximum Input Offset Current (IIO):

15 uA

Peak Bias Current:

4 uA

Maximum Bias Current (IIB) @25 °C:

4 uA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

16.5 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-16.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

4.25 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold Silver

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

THS3121IDGNG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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