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THS3120IDR

Texas Instruments

THS3120IDR by Texas Instruments

THS3120IDR by Texas Instruments is an Operational Amplifier (Op Amp) with 8 terminals in a small outline package. It features a max seated height of 1.75mm, suitable for industrial temperature grades. Ideal for applications requiring precise signal amplification in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,835 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,835

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Digiode

USA . 1,706 parts In-Stock

1+ parts

-

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-

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1,706

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,498 parts In-Stock

1+ parts

$3.410

100+ parts

-

1k+ parts

-

10k+ parts

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1,498

$3.410

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Parana Technologies

USA . 2,304 parts In-Stock

1+ parts

$3.441

100+ parts

-

1k+ parts

$3.967

10k+ parts

-

2,304

$3.441

-

$3.967

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ChromeModa Solutions

Germany . 4,947 parts In-Stock

1+ parts

$3.866

100+ parts

$3.170

1k+ parts

-

10k+ parts

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4,947

$3.866

$3.170

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IDEA Electronic Components Group

UK . 1,557 parts In-Stock

1+ parts

$3.866

100+ parts

-

1k+ parts

$3.479

10k+ parts

-

1,557

$3.866

-

$3.479

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AZTECH Wire

Italy . 391 parts In-Stock

1+ parts

$5.847

100+ parts

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10k+ parts

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391

$5.847

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Corphita

USA . 4,228 parts In-Stock

1+ parts

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4,228

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DigiPath Technology Company

USA . 2,094 parts In-Stock

1+ parts

-

100+ parts

$3.486

1k+ parts

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2,094

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$3.486

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Microchip USA

USA . 414 parts In-Stock

1+ parts

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414

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Overview

Get ready to experience unparalleled performance with the THS3120IDR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments sets the standard for quality and reliability. The THS3120IDR falls under the category of Operational Amplifiers (Op Amps), making it the perfect choice for a wide range of applications. Whether you're looking to boost signal strength or improve audio quality, this amplifier delivers exceptional value and benefits. Trust Texas Instruments to provide you with the best solutions for your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good protection and insulation for the internal components of the operational amplifier, ensuring reliable performance.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

Rectangular package shape facilitates easy integration into circuit designs and placement on PCBs.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the operational amplifier to external components, enabling versatile applications.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it ideal for compact designs and applications with limited board real estate.

Terminal Position: DUAL

Dual terminal position enhances signal routing options and circuit layout flexibility, improving overall performance and functionality.

Maximum Seated Height: 1.75 mm

Low maximum seated height allows for a slim profile, making it suitable for applications where space constraints are a concern.

Width: 3.9 mm

Narrow width enables close placement of multiple operational amplifiers on the PCB, optimizing layout and minimizing signal interference.

Length: 4.9 mm

Compact length further contributes to the space-saving design of the operational amplifier, ensuring efficient use of board real estate.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation over a wide range of temperature conditions, making it suitable for demanding industrial applications.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and PCB assembly, reducing the risk of solder joint failure and ensuring robust connections.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier design provides high gain and precise signal processing, making it ideal for various analog and mixed-signal applications.

Terminal Pitch: 1.27 mm

With a small terminal pitch, the operational amplifier offers high-density interconnection options, suitable for applications requiring fine-pitch components.

Technical Specifications

Operational Amplifiers (Op Amps) THS3120IDR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

THS3120IDR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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