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THS3120IDGNR

Texas Instruments

THS3120IDGNR by Texas Instruments

THS3120IDGNR by Texas Instruments is an Operational Amplifier with 8 terminals in a small square package. It features a low height of 1.07mm, 0.65mm terminal pitch, and Gull Wing terminal form. Ideal for industrial applications requiring compact design and high performance amplification.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,219 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

5,219

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-

-

-

Digiode

USA . 2,412 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,412

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 425 parts In-Stock

1+ parts

$0.410

100+ parts

-

1k+ parts

-

10k+ parts

-

425

$0.410

-

-

-

Parana Technologies

USA . 1,075 parts In-Stock

1+ parts

$2.416

100+ parts

-

1k+ parts

$2.912

10k+ parts

-

1,075

$2.416

-

$2.912

-

DigiPath Technology Company

USA . 256 parts In-Stock

1+ parts

$2.661

100+ parts

$2.448

1k+ parts

-

10k+ parts

-

256

$2.661

$2.448

-

-

ChromeModa Solutions

Germany . 5,032 parts In-Stock

1+ parts

$2.715

100+ parts

$2.226

1k+ parts

-

10k+ parts

-

5,032

$2.715

$2.226

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IDEA Electronic Components Group

UK . 961 parts In-Stock

1+ parts

$2.715

100+ parts

-

1k+ parts

$2.444

10k+ parts

-

961

$2.715

-

$2.444

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AZTECH Wire

Italy . 472 parts In-Stock

1+ parts

$7.292

100+ parts

-

1k+ parts

-

10k+ parts

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472

$7.292

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-

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Corphita

USA . 4,778 parts In-Stock

1+ parts

-

100+ parts

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4,778

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Microchip USA

USA . 490 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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490

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Overview

Experience unparalleled performance and reliability with the THS3120IDGNR by Texas Instruments, a leading manufacturer in the industry. This operational amplifier is perfect for a wide range of applications, delivering exceptional precision and efficiency. With its compact design and advanced features, this product offers unmatched value and benefits to customers looking for top-quality components. Trust Texas Instruments to provide you with the best solutions for your operational amplifier needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, allowing for easy handling and long-term reliability.

Surface Mount: YES

Being surface mount compatible means easier and more efficient assembly onto PCBs, saving time and effort in the production process.

No. of Terminals: 8

Having 8 terminals provides flexibility and compatibility with a variety of circuit configurations, offering versatile connectivity options.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh environments with fluctuations in temperature, making it suitable for a wide range of applications.

Technical Specifications

Operational Amplifiers (Op Amps) THS3120IDGNR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.042 in (1.07 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

Trade Compliance

THS3120IDGNR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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