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THS3120CDG4

Texas Instruments

THS3120CDG4 by Texas Instruments

THS3120CDG4 by Texas Instruments is a dual operational amplifier with 8 terminals in a small outline package. It features a max seated height of 1.75mm, suitable for commercial temperature grades. Ideal for applications requiring precise signal amplification in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,982 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,982

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-

-

-

Digiode

USA . 4,930 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,930

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 476 parts In-Stock

1+ parts

$0.410

100+ parts

-

1k+ parts

-

10k+ parts

-

476

$0.410

-

-

-

Parana Technologies

USA . 762 parts In-Stock

1+ parts

$1.408

100+ parts

-

1k+ parts

$2.110

10k+ parts

-

762

$1.408

-

$2.110

-

DigiPath Technology Company

USA . 160 parts In-Stock

1+ parts

$1.550

100+ parts

$1.426

1k+ parts

-

10k+ parts

-

160

$1.550

$1.426

-

-

ChromeModa Solutions

Germany . 2,061 parts In-Stock

1+ parts

$1.582

100+ parts

$1.297

1k+ parts

-

10k+ parts

-

2,061

$1.582

$1.297

-

-

IDEA Electronic Components Group

UK . 250 parts In-Stock

1+ parts

$1.582

100+ parts

-

1k+ parts

$1.424

10k+ parts

-

250

$1.582

-

$1.424

-

AZTECH Wire

Italy . 571 parts In-Stock

1+ parts

$15.332

100+ parts

-

1k+ parts

-

10k+ parts

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571

$15.332

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-

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Corphita

USA . 4,334 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,334

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Microchip USA

USA . 300 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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300

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Overview

Enhance your electronic designs with the THS3120CDG4 by Texas Instruments, a top-tier manufacturer known for delivering high-quality operational amplifiers. Perfect for a wide range of applications, this small outline package amplifier offers unparalleled performance and reliability. Upgrade your projects with ease with its dual terminal position and gull wing terminal form, making installations hassle-free. Get the competitive edge with the THS3120CDG4 and experience superior functionality and precision in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the op amp lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Package Shape: RECTANGULAR

Rectangular shape allows for compact and space-efficient board design.

No. of Terminals: 8

The 8 terminals provide flexibility for connecting to other components and peripherals.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, ideal for compact electronic devices.

Terminal Position: DUAL

Dual terminal position enables versatile mounting options for different PCB layouts.

Maximum Seated Height: 1.75 mm

Low maximum seated height allows for slim and streamlined product designs.

Width: 3.9 mm

Narrow width makes the op amp suitable for applications with space constraints.

Length: 4.9 mm

Compact length allows for integration into small electronic devices or circuits.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation within standard temperature ranges.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections during assembly and operation.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier type offers high performance and precision for signal processing applications.

Terminal Pitch: 1.27 mm

Small terminal pitch allows for fine pitch mounting, suitable for high-density applications.

Technical Specifications

Operational Amplifiers (Op Amps) THS3120CDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

THS3120CDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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