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THS3110CDGN

Texas Instruments

THS3110CDGN by Texas Instruments

THS3110CDGN by Texas Instruments is an Operational Amplifier with 8 terminals in a small square package. It features a terminal pitch of 0.65mm, dual terminal position, and Gull Wing form. Ideal for commercial applications requiring high-performance amplification in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,171 parts In-Stock

1+ parts

-

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6,171

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Digiode

USA . 4,465 parts In-Stock

1+ parts

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-

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4,465

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 995 parts In-Stock

1+ parts

$5.081

100+ parts

-

1k+ parts

$5.657

10k+ parts

-

995

$5.081

-

$5.657

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ChromeModa Solutions

Germany . 1,443 parts In-Stock

1+ parts

$5.709

100+ parts

$4.681

1k+ parts

-

10k+ parts

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1,443

$5.709

$4.681

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IDEA Electronic Components Group

UK . 1,432 parts In-Stock

1+ parts

$5.709

100+ parts

-

1k+ parts

$5.138

10k+ parts

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1,432

$5.709

-

$5.138

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One Stop Electronics

USA . 1,135 parts In-Stock

1+ parts

$9.410

100+ parts

-

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-

10k+ parts

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1,135

$9.410

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AZTECH Wire

Italy . 501 parts In-Stock

1+ parts

$14.105

100+ parts

-

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501

$14.105

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DigiPath Technology Company

USA . 464 parts In-Stock

1+ parts

-

100+ parts

$5.147

1k+ parts

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10k+ parts

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464

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$5.147

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Corphita

USA . 407 parts In-Stock

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407

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Microchip USA

USA . 142 parts In-Stock

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142

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Overview

Discover the unbeatable quality of the THS3110CDGN by Texas Instruments, a leading manufacturer in the industry. This operational amplifier offers unmatched precision and reliability for a wide range of applications. From audio systems to medical devices, this product ensures top-notch performance and efficiency. Trust in Texas Instruments to provide you with the best technology available, delivering value and benefits that are second to none. Elevate your projects with the THS3110CDGN and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Package Shape: SQUARE

The square package shape provides a compact footprint, making it suitable for space-constrained designs.

No. of Terminals: 8

Having 8 terminals allows for more versatile connections and configurations in the circuit layout.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

The combination of small outline, heat sink/slug, thin profile, and shrink pitch in the package style enhances thermal dissipation and overall performance of the operational amplifier.

Maximum Seated Height: 1.07 mm

The low maximum seated height contributes to a slim and compact design, particularly beneficial in applications where space is limited.

Width: 3 mm

The narrow width of the product allows for efficient use of board space and high-density integration in electronic circuits.

Length: 3 mm

The short length of the product further enhances its compactness and suitability for miniaturized electronic devices.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation within standard temperature ranges, making it suitable for general purpose applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering onto the PCB and provides mechanical strength to withstand vibrations and shocks.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this product offers high gain, precision, and stability for a wide range of analog signal processing applications.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for dense packing of components on the circuit board, enabling complex circuit designs in a limited space.

Technical Specifications

Operational Amplifiers (Op Amps) THS3110CDGN attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.042 in (1.07 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

Trade Compliance

THS3110CDGN Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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