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THS3110CDG4

Texas Instruments

THS3110CDG4 by Texas Instruments

THS3110CDG4 by Texas Instruments is a dual operational amplifier with 8 terminals in a small outline package. It features a max seated height of 1.75mm, suitable for commercial temperature grade applications. Ideal for compact designs requiring high-performance op amps.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,437 parts In-Stock

1+ parts

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2,437

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Digiode

USA . 2,294 parts In-Stock

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2,294

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Distributors (Availability)

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One Stop Electronics

USA . 757 parts In-Stock

1+ parts

$1.410

100+ parts

-

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757

$1.410

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Parana Technologies

USA . 1,475 parts In-Stock

1+ parts

$5.975

100+ parts

$554.912

1k+ parts

$5.378

10k+ parts

-

1,475

$5.975

$554.912

$5.378

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DigiPath Technology Company

USA . 2,329 parts In-Stock

1+ parts

$6.580

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2,329

$6.580

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ChromeModa Solutions

Germany . 6,418 parts In-Stock

1+ parts

$6.714

100+ parts

$5.505

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6,418

$6.714

$5.505

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IDEA Electronic Components Group

UK . 2,145 parts In-Stock

1+ parts

$6.714

100+ parts

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1k+ parts

$6.043

10k+ parts

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2,145

$6.714

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$6.043

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AZTECH Wire

Italy . 883 parts In-Stock

1+ parts

$16.282

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883

$16.282

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Component Stockers USA

USA . 655 parts In-Stock

1+ parts

$99.990

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655

$99.990

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Microchip USA

USA . 5,554 parts In-Stock

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5,554

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Corphita

USA . 503 parts In-Stock

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503

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Overview

Unlock the full potential of your electronic designs with the THS3110CDG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. The THS3110CDG4 falls under the category of Operational Amplifiers (Op Amps), making it suitable for a wide range of applications. With its compact design and high performance, this operational amplifier offers exceptional value and benefits to customers looking to optimize their circuits. Upgrade your projects today with the THS3110CDG4 and experience unparalleled precision and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the operational amplifier, ensuring reliable performance and longevity.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to design and layout in circuit boards, optimizing space usage.

No. of Terminals: 8

With 8 terminals, this operational amplifier offers flexibility in connectivity options, making it suitable for a variety of applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for compact designs in electronic systems.

Terminal Position: DUAL

Dual terminal position enables a more secure and stable connection, reducing the risk of signal interference or loss.

Maximum Seated Height: 1.75 mm

The low seated height of 1.75 mm minimizes the overall profile of the operational amplifier, making it suitable for applications with height restrictions.

Width: 3.9 mm

The compact width of 3.9 mm allows for efficient use of space on the PCB, especially in designs where space is limited.

Length: 4.9 mm

With a length of 4.9 mm, this operational amplifier is compact and can be easily integrated into small electronic devices.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that this operational amplifier is suitable for standard operating conditions, making it a versatile choice for various applications.

Terminal Form: GULL WING

The gull wing terminal form offers a sturdy and reliable connection, enhancing the overall durability and performance of the operational amplifier.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this product is designed for high-performance signal processing and amplification, making it a reliable choice for precision applications.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for precise and compact PCB layouts, ensuring efficient signal routing and minimal signal distortion.

Technical Specifications

Operational Amplifiers (Op Amps) THS3110CDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

THS3110CDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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