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THS3092DR

Texas Instruments

THS3092DR by Texas Instruments

THS3092DR by Texas Instruments is a dual operational amplifier with 8 terminals in a small outline package. It features industrial temperature grade, Gull Wing terminal form, and 1.27 mm pitch. Ideal for applications requiring precise signal amplification in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,991 parts In-Stock

1+ parts

-

100+ parts

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6,991

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Digiode

USA . 2,386 parts In-Stock

1+ parts

-

100+ parts

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2,386

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 505 parts In-Stock

1+ parts

$3.457

100+ parts

-

1k+ parts

$3.981

10k+ parts

-

505

$3.457

-

$3.981

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DigiPath Technology Company

USA . 1,457 parts In-Stock

1+ parts

$3.806

100+ parts

-

1k+ parts

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10k+ parts

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1,457

$3.806

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-

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ChromeModa Solutions

Germany . 6,671 parts In-Stock

1+ parts

$3.884

100+ parts

$3.185

1k+ parts

-

10k+ parts

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6,671

$3.884

$3.185

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IDEA Electronic Components Group

UK . 417 parts In-Stock

1+ parts

$3.884

100+ parts

-

1k+ parts

$3.496

10k+ parts

-

417

$3.884

-

$3.496

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AZTECH Wire

Italy . 815 parts In-Stock

1+ parts

$6.735

100+ parts

-

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10k+ parts

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815

$6.735

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One Stop Electronics

USA . 1,140 parts In-Stock

1+ parts

$9.410

100+ parts

-

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1,140

$9.410

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Corphita

USA . 2,766 parts In-Stock

1+ parts

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2,766

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Microchip USA

USA . 236 parts In-Stock

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236

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Overview

Unleash the power of precision with the THS3092DR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality and reliability in operational amplifiers. This versatile product offers unmatched performance in a wide range of applications, providing customers with unparalleled value and benefits. Elevate your designs with the THS3092DR and experience the advantage of top-notch engineering and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and simplifying assembly.

No. of Functions: 2

Having 2 functions in one package increases versatility and functionality in circuit design.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement and use of space on circuit boards.

No. of Terminals: 8

Having 8 terminals provides multiple connection points for various inputs and outputs, enabling complex circuit configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style minimizes footprint on circuit boards, ideal for compact designs.

Terminal Position: DUAL

Dual terminal position allows for easy connections and secure attachment in circuit applications.

Maximum Seated Height: 1.75 mm

Low seated height enables the op amp to be installed in tight spaces with minimal clearance.

Width: 3.9 mm

Narrow width facilitates efficient layout and placement in densely populated circuit boards.

Length: 4.9 mm

Compact length makes the op amp suitable for smaller electronic devices and designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in a wide range of environmental conditions.

Terminal Form: GULL WING

Gull wing terminal form offers secure solder connections for enhanced stability and reliability.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier type provides precision and accuracy for various signal processing applications.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for precise connection spacing and compatibility with standard soldering techniques.

Technical Specifications

Operational Amplifiers (Op Amps) THS3092DR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

2

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

THS3092DR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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